Multi-Hole Probe Pressure Sensors

A method of manufacturing a multi-hole probe pressure sensor, the method comprising:

• preparing a Silicon-On-Insulator (SOI) wafer including a buried oxide layer;
• forming a plurality of dies each containing a plurality of cavities on a back side of the SOI wafer;
• etching the buried oxide into a diaphragm for each of the plurality of dies and a gap area between the plurality of dies;
• depositing a metal layer on the back side of the SOI wafer;
• and
• releasing an individual die from the SOI wafer.

A multi-hole probe pressure sensor, comprising:

• a multi-fiber ferrule including a plurality of die channels, each enclosing optical fibers to transmit EM waves;
• a sensor die comprising a plurality of transducers attached to the multi-fiber ferrule, wherein each of the plurality of transducers includes a diaphragm over a cavity;
• and
• a probe tip including a plurality of probe tip tubes inside the tip and attaching to the sensor die;
• wherein each of the plurality of transducers connects to one of the plurality of probe tip tubes and one of the plurality of die channels;
• and
• wherein each of the plurality of probe tip tubes comprises a first portion and a second portion, wherein the first portion has a smaller diameter than the second portion.