Method for manufacturing thermal print head structure

A method for manufacturing thermal print head structure, comprising:

• forming a glaze layer on a substrate;
• forming a heating resistor layer on the glaze layer and the substrate;
• forming an electrode layer on the heating resistor layer;
• forming a photoresist layer on one portion of the electrode layer, wherein the photoresist layer is formed with an arc ridge portion in accordance with a formation of the glaze layer;
• removing one portion of the arc ridge portion of the electrode layer such that a sunken portion having a bottom therein is formed on the photoresist layer;
• sequentially removing overlapping parts of the electrode layer and the heating resistor layer which are overlapped with each other and not covered by the photoresist layer;
• entirely thinning a thickness of the photoresist layer to remove the bottom of the sunken portion of the photoresist layer, so that a local position of the electrode layer is exposed outwardly from the photoresist layer;
• etching the local position of the electrode layer so that the heating resistor layer is partially revealed outwardly from the photoresist layer;
• removing the photoresist layer from the electrode layer;
• and
• forming a protective layer on the electrode layer, the heating resistor layer and the substrate.