Electronic Power Module
AssigneeAB Mikroelektronik Gesellschaft mit beschraenkter Haftung
InventorLouis Costa
Life of this patent
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Abstract
Electronic power modules are disclosed. In one example, an electronic power module includes a first aluminum substrate, a second aluminum substrate, and a third aluminum substrate arranged in a common plane. The electronic power module includes first gap separating the first aluminum substrate from the second aluminum substrate. The electronic power module includes a second gap separating the second aluminum substrate from the third aluminum substrate. The electronic power module includes a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate. The electronic power module includes a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.
Claims20
An electronic power module, comprising:
- a first aluminum substrate operable at a first potential;
- a second aluminum substrate operable at a second potential, the second aluminum substrate arranged in a common plane with the first aluminum substrate;
- a third aluminum substrate operable at a third potential, the third aluminum substrate arranged in a common plane with the first aluminum substrate and the second aluminum substrate;
- a first gap separating the first aluminum substrate from the second aluminum substrate;
- a second gap separating the second aluminum substrate from the third aluminum substrate;
- a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate;
- and
- a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.
A method of manufacturing an electronic power module, the power module comprising a first aluminum substrate operable at a first potential;
- a second aluminum substrate operable at a second potential, the second aluminum substrate arranged in a common plane with the first aluminum substrate;
- a third aluminum substrate operable at a third potential, the third aluminum substrate arranged in a common plane with the first aluminum substrate and the second aluminum substrate;
- a first gap separating the first aluminum substrate from the second aluminum substrate;
- a second gap separating the second aluminum substrate from the third aluminum substrate;
- a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate;
- and a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate, the method comprising:
- punching the first aluminum substrate, the second aluminum substrate, and the third aluminum substrate from a sheet of aluminum such that the first gap separates the first aluminum substrate from the second aluminum substrate and the second gap separates the second aluminum substrate from the third aluminum substrate;
- the first aluminum substrate connected to the second aluminum substrate by one or more bridges;
- the second aluminum substrate connected to the third aluminum substrate by one or more bridges;
- screen printing one or more circuit components on the first aluminum substrate, the second aluminum substrate, and the third aluminum substrate;
- connecting the first semiconductor switching component to the first aluminum substrate and the second aluminum substrate;
- connecting the second semiconductor switching component to the second aluminum substrate and the third aluminum substrate;
- attaching the first aluminum substrate, second aluminum substrate, and the third aluminum substrate to a heat spreader via an isolating layer;
- punching the one or more bridges connecting the first aluminum substrate and the second aluminum substrate and the one or more bridges connecting the second aluminum substrate and the third aluminum substrate to separate the first aluminum substrate from the second aluminum substrate and to separate the second aluminum substrate from the third aluminum substrate;
- covering the first aluminum substrate, the second aluminum substrate, and the third aluminum substrate with a packaging material.
Dependencies are inferred from the claim text.