Bonded memory devices having flash memory controller and fabrication and operation methods thereof

A method for forming a memory device, comprising:

• forming a first semiconductor structure comprising a Flash memory controller, a peripheral circuit, and a first bonding layer comprising a plurality of first bonding contacts;
• forming a second semiconductor structure comprising an array of NAND memory cells and a second bonding layer comprising a plurality of second bonding contacts;
• and
• bonding the first semiconductor structure and the second semiconductor structure in a face-to-face manner, such that the first bonding contacts are in contact with the second bonding contacts at a bonding interface.

A method for operating a memory device comprising a Flash memory controller, a peripheral circuit, and an array of NAND memory cells in a same bonded chip, the method comprising:

• receiving, by the Flash memory controller, an instruction from a host processor;
• transmitting, by the Flash memory controller, control signals to the array of NAND memory cells through a plurality of bonding contacts to control operations of the array of NAND memory cells based on the instruction;
• and
• receiving, by the Flash memory controller, status signals indicative of the operations from the array of NAND memory cells through the plurality of bonding contacts.