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US 2020/0350280 A1Published application
Protective layer for contact pads in fan-out interconnect structure and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChin-Chuan Chang, Tsei-Chung Fu, Jing-Cheng Lin
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Abstract
A method includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer.
Claims20
A method comprising:
- forming a contact pad over a substrate;
- forming a passivation layer over the substrate and the contact pad;
- forming a first opening in the passivation layer, the first opening exposing a top surface of the contact pad;
- and
- forming a conductive protective layer in the first opening, wherein forming the conductive protective layer comprises:
- depositing a first conductive material in the first opening, the first conductive material being in physical contact with a sidewall of the first opening;
- and
- depositing a second conductive material over the first conductive material and the passivation layer, the second conductive material being different from the first conductive material, the second conductive material being in physical contact with a top surface of the passivation layer, a portion of the second conductive material laterally extending beyond an outermost sidewall of the first conductive material at the end of depositing the second conductive material.
5 more elements
A method comprising:
- forming a contact pad over a substrate;
- and
- forming a conductive protective layer over the contact pad, wherein forming the conductive protective layer comprises:
- electroless plating the contact pad with a first conductive material;
- and
- electroless plating the first conductive material with a second conductive material different from the first conductive material, a maximum width of the second conductive material being greater than a maximum width of the first conductive material at the end of electroless plating the first conductive material with the second conductive material.
3 more elements
A device comprising:
- a contact pad over a substrate;
- a passivation layer over and covering edges of the contact pad;
- and
- a conductive protective layer over the contact pad, the conductive protective layer comprising:
- a first portion comprising a first conductive material, the first conductive material extending through the passivation layer and being in physical contact with the contact pad;
- and
- a second portion over the first portion, the second portion comprising a second conductive material different from the first conductive material, the second conductive material extending along and being in physical contact with a top surface of the passivation layer, a maximum width of the second conductive material being greater than a maximum width of the first conductive material.
4 more elements
Dependencies are inferred from the claim text.