Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorYu-Ying LEE
Life of this patent
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Abstract
A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the first conductive post. The first adhesive layer comprises conductive particles and an adhesive. The first conductive post has a height measured from the upper surface to the lower surface and a width. The height is greater than the width.
Claims20
A semiconductor device package, comprising:
- a substrate;
- a first conductive post disposed on the substrate;
- and
- a second conductive post disposed on the substrate;
- wherein the first conductive post electrically connects with the second conductive post by the substrate;
- wherein the first and second conductive post each includes an external contact opposite to the substrate.
A semiconductor device package, comprising:
- a carrier including a first surface;
- a conductive post disposed over the first surface;
- a first adhesive layer disposed between the first surface and the conductive post, the first adhesive layer comprising conductive particles and an adhesive;
- an electronic component disposed on the first surface of the carrier;
- and
- an insulating layer encapsulating the electronic component and conductive post.
Dependencies are inferred from the claim text.