Lead frame package having conductive surface with integral lead finger

A process comprising:

• forming a lead frame from a material, the lead frame comprising:
• a body with a top surface and a bottom surface and a plurality of lead fingers, each lead finger having a first end and a second end, the first end being attached to the body and the second end being in a different plane than the first end and the body;
• a first flag being a first exposed portion of the top surface of the body of the lead frame and integral with a first lead finger of the plurality of lead fingers, wherein the first flag and the first lead finger are a continuous material;
• and
• a second flag being a second exposed portion of the top surface of the body of the lead frame and integral with a second lead finger of the plurality of lead fingers, wherein the second flag and the second lead finger are a continuous material;
• coupling a semiconductor die to the bottom surface of the body;
• connecting the semiconductor die to the first flag and the second flag;
• and
• encapsulating the semiconductor die, the bottom surface of the body, the first end of the plurality of lead fingers and a portion of the top surface of the body with an encapsulant;
• wherein the first flag and the second flag are separated and electrically isolated from one another by the encapsulant.