Copper metallization fill
AssigneeInternational Business Machines Corporation
InventorsKoichi Motoyama, Oscar van der Straten, Joseph F. Maniscalco, Alexander Reznicek, Raghuveer Reddy Patlolla, Theodorus E. Standaert
Life of this patent
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Abstract
A method including forming a dual damascene interconnect structure comprising a metal wire above a via, recessing the metal wire to form a trench, depositing a liner along a bottom and a sidewall of the trench, and forming a new metal wire in the trench. The method may also include forming a dual damascene interconnect structure comprising a metal wire above a via, recessing the metal wire to form a trench, depositing a liner along a bottom and a sidewall of the trench, removing the liner along the bottom of the trench, and forming a new metal wire in the trench.
Claims19
A method comprising:
- forming a dual damascene interconnect structure comprising a metal wire above a via;
- recessing the metal wire to form a trench;
- depositing a liner along a bottom and a sidewall of the trench;
- and
- forming a new metal wire in the trench.
A method comprising:
- forming a dual damascene interconnect structure comprising a metal wire above a via;
- recessing the metal wire to form a trench;
- depositing a liner along a bottom and a sidewall of the trench;
- removing the liner along the bottom of the trench;
- and
- forming a new metal wire in the trench.
A dual damascene structure comprising:
- a metal wire;
- a via below and in electrical contact with the metal wire;
- and
- a liner positioned along vertical sidewalls of the metal wire, wherein a height of the liner is less than a height of the metal wire.
Dependencies are inferred from the claim text.