Low cost package warpage solution

An electronic device comprising:

• a package substrate having one or more conductive traces over a first surface of the package substrate;
• solder resist material over the one or more conductive traces;
• one or more conductive through vias from the first surface of the package substrate to a second surface of the package substrate that is opposite from the first surface of the package substrate, wherein one or more of the conductive vias are electrically coupled to a conductive trace of the one or more conductive traces;
• a reinforcement layer over the package substrate, wherein the reinforcement layer has at least one opening;
• a device die electrically coupled to the one or more conductive traces by one or more solder bumps, wherein the device die is positioned in the opening of the reinforcement layer;
• and
• wherein a first gap between a first edge of the device die and a first sidewall of the opening is larger than a second gap between a second edge of the device die and a second sidewall of the opening.

An electronic device, comprising:

• a substrate layer having a first top side and a second bottom side opposite the first top side;
• a first conductor through the substrate layer from the first top side to the second bottom side;
• a second conductor through the substrate layer from the first top side to the second bottom side;
• a first trace over the first top side of the substrate layer, the first trace electrically connected to the first conductor through the substrate layer;
• a second trace over the first top side of the substrate layer, the second trace electrically connected to the second conductor through the substrate layer;
• a first solder bump over the first top side of the substrate layer, the first solder bump electrically connected to the first trace;
• a second solder bump over the first top side of the substrate layer, the second solder bump electrically connected to the second trace;
• a reinforcement layer over the first top side of the substrate layer, the reinforcement layer having at least one opening;
• a device die over the first top side of the substrate layer, a bottom of the device die being electrically connected to the first solder bump and the second solder bump, the device die being within the opening of the reinforcement layer;
• and
• wherein, along a line across the device die, there is a first distance between a first side of the device die and a first portion of the reinforcement layer closest to the first side of the device die, a second distance between a second side of the device die and a second portion of the reinforcement layer closest to the second side of the device die, and the first distance is larger than the second distance so the device die is off-center within the opening of the reinforcement layer.

A system comprising:

• a package substrate having one or more conductive traces over a first surface of the package substrate;
• solder resist material over the one or more conductive traces;
• one or more conductive through vias from the first surface of the package substrate to a second surface of the package substrate that is opposite from the first surface of the package substrate, wherein one or more of the conductive vias are electrically coupled to a conductive trace of the one or more conductive traces;
• a reinforcement layer over the package substrate, wherein the reinforcement layer has at least one opening;
• a device die electrically coupled to the one or more conductive traces by one or more solder bumps, the device die in the opening of the reinforcement layer;
• wherein a first gap between a first edge of the device die and a first sidewall of the opening is larger than a second gap between a second edge of the device die and a second sidewall of the opening;
• and
• a board.