Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYou-Lung YEN, Bernd Karl APPELT, Kay Stefan ESSIG
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Abstract
At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a carrier having a first surface and a second surface opposite to the first surface, an encapsulant, and an antenna. The encapsulant is disposed on the first surface of the carrier. The antenna is disposed on the encapsulant. The antenna includes a seed layer and a conductive layer.
Claims37
A semiconductor device package, comprising:
- a carrier having a first surface and a second surface opposite to the first surface;
- an encapsulant disposed on the first surface of the carrier;
- and
- an antenna disposed on the encapsulant, the antenna including a seed layer and a conductive layer.
A semiconductor device package, comprising:
- a carrier having a first surface and a second surface opposite to the first surface, the carrier including a first layer proximal to the first surface and a second layer proximal to the second surface, the second layer including a bi-layer;
- and
- an encapsulant disposed on the first surface of the carrier,
- an antenna disposed on the encapsulant, the antenna including a seed layer and a conductive layer,
- wherein a material of one of the seed layer and the conductive layer of the antenna is the same as a material of one of the bi-layer of the second layer.
A method of manufacturing a semiconductor package device, comprising:
- providing a carrier including a first patterned layer proximal to a first surface of the carrier;
- encapsulating the carrier by an encapsulant;
- forming trenches in the encapsulant;
- forming a conductive layer in the trenches and on the carrier;
- and
- subsequent to forming the conductive layer in the trenches and on the carrier, forming a second patterned layer proximal to a second surface of the carrier, the second surface being opposite to the first surface.
A semiconductor device package, comprising:
- a carrier;
- a first semiconductor device disposed on the carrier;
- a first encapsulant disposed on the carrier, the encapsulant encapsulating the first semiconductor device and carrier;
- a patterned conductive layer embedded in the encapsulant, the patterned conductive layer including a top surface exposed from the first encapsulant;
- and
- a second encapsulant disposed on the first encapsulant.
Dependencies are inferred from the claim text.