Method and chamber for backside physical vapor deposition
AssigneeApplied Materials, Inc.
InventorsChunming ZHOU, Jothilingam RAMALINGAM, Yong CAO, Kevin Vincent MORAES, Shane LAVAN
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AssigneeApplied Materials, Inc.
InventorsChunming ZHOU, Jothilingam RAMALINGAM, Yong CAO, Kevin Vincent MORAES, Shane LAVAN
Estimating the term…
Embodiments of the present disclosure generally relate to methods and apparatus for backside stress engineering of substrates to combat film stresses and bowing issues. In one embodiment, a method of depositing a film layer on a backside of a substrate is provided. The method includes flipping a substrate at a factory interface so that the backside of the substrate is facing up, and transferring the flipped substrate from the factory interface to a physical vapor deposition chamber to deposit a film layer on the backside of the substrate. In another embodiment, an apparatus for depositing a backside film layer on a backside of a substrate, which includes a substrate supporting surface configured to support the substrate at or near the periphery of the substrate supporting surface without contacting an active region on a front side of the substrate.
A method of depositing a backside film layer on a backside of a substrate, comprising:
A method of depositing a backside film layer on a backside of a substrate, comprising:
A cluster tool for depositing a backside film layer on a backside of a substrate, comprising:
Dependencies are inferred from the claim text.