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US 2020/0350147 A1Published application
Substrate processing apparatus
AssigneePsk Inc.
InventorHUNG SHENG WANG
Life of this patent
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Abstract
The inventive concept relates to an apparatus for processing a substrate. The substrate processing apparatus includes a scatter that is disposed over a baffle and that separates plasma and impurities. The scatter includes a plate having a first opening formed in a central area thereof when viewed from above and a collision block that is disposed over the first opening to face the first opening and that collides with plasma supplied from a plasma generation unit and impurities.
Claims12
An apparatus for processing a substrate, the apparatus comprising:
- a housing having a processing space formed therein;
- a support unit configured to support the substrate in the processing space;
- a plasma generation unit located above the support unit and configured to supply plasma into the processing space;
- a baffle disposed between the support unit and the plasma generation unit and configured to allow the plasma to pass through;
- and
- a scatter disposed over the baffle and configured to separate the plasma and impurities,
- wherein the scatter includes:
- a plate having a first opening formed in a central area thereof when viewed from above;
- and
- a collision block disposed over the first opening to face the first opening and configured to collide with the plasma supplied from the plasma generation unit and the impurities.
7 more elements
Dependencies are inferred from the claim text.