Weathering-resistant transparent thin film

Abstract

The present invention provides a novel structure for a weathering-resistant transparent conductive film (TCF) which can be applied on most kinds of flexible electronics, telecommunication components, smart-window, sensing film, optoelectronic devices or display panel, etc. The present weathering-resistant TCF includes at least one transparent substrate, a deformable layer and a multi-layered conductive structure having a high aspect ratio being integrated into the deformable layer forming an enveloped structure such that at least one surface of the conductive network being exposed out of the surface. The enveloped TCF structure enables protection of the underneath conductive layer such that the present weathering-resistant TCF can withstand in extreme temperature, humidity and corrosive environment. The present invention also relates to methods of fabricating a weathering-resistant TCF, which facilitates large area thin film fabrication and large scale production.

Dependencies are inferred from the claim text.