Devices for high-density probing techniques and method of implementing the same

A method, comprising:

• (a) contacting a sample using a testing head comprising a printed circuit board (PCB) and a plurality of probing tips coupled to the PCB;
• (b) determining whether there is adequate electrical contact between each individual one of the plurality of probing tips and the sample;
• (c) adding one or more backers to the PCB,
• wherein each backer extends from the PCB to a stiffener that is coupled to the PCB and comprises at least one tuning hole, and wherein each backer is formed separately from the stiffener;
• and
• (d) adding at least one patch between the probe card printed circuit board and the individual discrete backer units.

A method, comprising:

• (a) contacting a sample using a testing head, the testing head comprising:
• a probe card printed circuit board,
• a stiffener coupled to and reinforcing the probe card printed circuit board,
• a discrete backer extending from the probe card printed circuit board to the stiffener, and
• at least one probing tip extending from a distal end of the testing head;
• and
• (b) determining whether there is adequate electrical contact between the at least one probing tip and the sample;
• and
• (c) adding at least one patch, wherein (i) the at least one patch is positioned between the probe card printed circuit board and the discrete backer, (ii) the at least one patch is positioned between the stiffener and the discrete backer, or (iii) both.