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US 2020/0347268 A1Published application
Polishing liquid and chemical mechanical polishing method
AssigneeFUJIFILM Corporation
InventorTetsuya KAMIMURA
Life of this patent
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Abstract
A polishing liquid is used for chemical mechanical polishing and includes colloidal silica; and an onium salt containing a cation, in which a content of the onium salt is more than 0.01% by mass, a zeta potential of the colloidal silica measured in a state where the colloidal silica is present in the polishing liquid is 15 mV or more, an electrical conductivity is 10 μS/cm or more, and a pH is 2 to 4.
Claims17
A polishing liquid used for chemical mechanical polishing, the polishing liquid comprising:
- colloidal silica;
- and
- an onium salt containing a cation,
- wherein a content of the onium salt is more than 0.01% by mass,
- a zeta potential of the colloidal silica measured in a state where the colloidal silica is present in the polishing liquid is 15 mV or more,
- an electrical conductivity is 10 μS/cm or more, and
- a pH is 2 to 4.
4 more elements
Dependencies are inferred from the claim text.