Resin composition for insulating film

A resin composition for an insulating film, the resin composition comprising:

• (A) a polyimide precursor having a unit structure represented by the following general formula (1):
• wherein X1 is a tetravalent organic group having 6 to 40 carbon atoms, Y1 is a divalent organic group having 6 to 40 carbon atoms, and each of R1 and R2 is independently a hydrogen atom or a monovalent organic group selected from the following general formulae (2) and (3):
• wherein each of R3, R4, and R5 is independently a hydrogen atom or a monovalent organic group having 1 to 3 carbon atoms, m is an integer of 1 to 10, and * is a site bonded to a carboxylic acid present in the polyamic acid main chain of general formula (1),
• [Formula 68]
• R6—* (3)
• wherein R6 is a monovalent organic group selected from alkyl groups having 1 to 30 carbon atoms and optionally being interrupted by an ether oxygen atom, and * is as defined above,
• wherein a proportion of the total amount of the monovalent organic group represented by general formula (2) above and the monovalent organic group represented by general formula (3) above in the total amount of R1 and R2 is 80% by mole or more, and a proportion of the amount of the monovalent organic group represented by general formula (3) above in the total amount of R1 and R2 ranges 1 to 100% by mole;
• (B) a compound that satisfies all of the following requirements (a) to (d):
• (a) having at least one carboxyl group,
• (b) having a partial structure represented by formula (N-1) or formula (N-2) below, wherein every structure represented by formula (N-1) is bonded to an aromatic ring or a carbonyl group at at least one site of the structure, or is part of a guanidine scaffold, and every structure represented by formula (N-2) is bonded to a carbon atom having an unsaturated bond at a site of the nitrogen atom, with the proviso that when formula (N-1) is part of a guanidine scaffold, at least one of the two structures (N-1) contained in the guanidine scaffold is bonded to an aromatic ring or a carbonyl group:
• wherein formulae (N-1) and (N-2) represent a trivalent structure in the compound,
• (c) at least one partial structure represented by formula (N-1) above being a partial structure of a structure which is represented by the following formula (ND-1), and
• which is not directly bonded to an aromatic ring and a carbonyl group, or at least one partial structure represented by formula (N-2) above being a partial structure of a structure represented by the following formula (ND-2):
• wherein formulae (ND-1) and (ND-2) represent a divalent structure in the compound, and D is a protecting group which is replaceable by a hydrogen atom upon heating,
• (d) having, relative to one carboxyl group, at least one structure represented by formula (ND-1) or (ND-2) defined in requirement (c) above;
• and
• (C) an organic solvent.