Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
AssigneeLG Chem, Ltd.
InventorsMinsu JEONG, You Jin KYUNG, Byung Ju CHOI, Woo Jae JEONG, Kwang Joo LEE, Eunbyurl CHO
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Abstract
The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
Claims21
An epoxy resin composition for molding a semiconductor, comprising:
- an epoxy resin containing an epoxy polymer represented by Chemical Formula 1 and an epoxy compound represented by Chemical Formula 2;
- and
- 50% by weight or more and 90% by weight or less of an inorganic filler:
- wherein, in the Chemical Formula 1, R is an alkyl group having 1 to 20 carbon atoms or a cycloalkyl group having 3 to 20 carbon atoms, n is an integer from 1 to 30, C1 is a cycloalkane having 3 to 10 carbon atoms, and L1 is a direct bond or an alkylene group having 1 to 10 carbon atoms,
- wherein, in the Chemical Formula 2, C2 to C3 are each independently a cycloalkane having 3 to 10 carbon atoms to which an epoxy group is bonded, and L2 is a direct bond or an alkylene group having 1 to 10 carbon atoms.
(canceled)
A molding film comprising a polymer containing a repeating unit represented by Chemical Formula 3 and a repeating unit represented by Chemical Formula 4;
- and 50% by weight or more and 90% by weight or less of an inorganic filler dispersed in the polymer:
- wherein, in the Chemical Formulae 3 and 4, C4 to C8 are each independently a cycloalkane having 3 to 10 carbon atoms, and L3 to L5 are each independently a direct bond or an alkylene group having 1 to 10 carbon atoms.
A molding film comprising:
- a cyclic aliphatic epoxy resin matrix;
- and an inorganic filler dispersed in the cyclic aliphatic epoxy resin matrix, wherein an absolute value of the difference between the refractive index of the cyclic aliphatic epoxy resin matrix and the refractive index of the inorganic filler is 0.1 or less.
Dependencies are inferred from the claim text.