Method for forming multi-depth mems package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Chuan Tai, Fan Hu
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a MEMS package having different trench depths, and a method of fabricating the MEMS package. In some embodiments, a cap substrate is bonded to a device substrate. The cap substrate comprises a first trench, a second trench, and an edge trench recessed from at a front-side surface of the cap substrate. A stopper is disposed within the first trench and raised from a bottom surface of the first trench. The stopper has a top surface lower than the front-side surface of the cap substrate.
Claims20
A microelectromechanical systems (MEMS) package, comprising:
- a cap substrate bonded to a device substrate, the cap substrate comprising a first trench, a second trench, and an edge trench recessed from at a front-side surface of the cap substrate;
- and
- a stopper disposed within the first trench and raised from a bottom surface of the first trench;
- wherein the stopper has a top surface lower than the front-side surface of the cap substrate.
A microelectromechanical systems (MEMS) package, comprising:
- a device substrate comprising a first MEMS device and a second MEMS device;
- and
- a cap substrate bonded to the device substrate, the cap substrate comprising a first trench overlying the first MEMS device, a second trench overlying the second MEMS device, and a scribe trench disposed in a scribe line region and recessed from a front-side surface of the cap substrate;
- wherein a stopper is disposed within the first trench and raised from a bottom surface of the first trench to a position vertically lower than the front-side surface of the cap substrate.
A microelectromechanical systems (MEMS) package, comprising:
- a device substrate comprising a first MEMS device and a second MEMS device;
- and
- a cap substrate bonded to the device substrate, the cap substrate enclosing a first cavity overlying the first MEMS device and a second cavity overlying the second MEMS device;
- wherein the first cavity has a first depth with respect to a front-side surface of the cap substrate smaller than a second depth of the second cavity with respect to the front-side surface of the cap substrate;
- and
- wherein a stopper is raised from a bottom surface of the first cavity to a position within the first cavity and vertically lower than the front-side surface of the cap substrate.
Dependencies are inferred from the claim text.