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US 2020/0346484 A1Published application
Method and device for surface processing
AssigneeHymmen GmbH Maschinen- und Anlagenbau
InventorRené PANKOKE
Life of this patent
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Abstract
A method for processing a surface (2) of a workpiece (1) is disclosed. Besides, a device for performing the method is disclosed.
Claims19
Method for removing parts of a layer (2) on a surface of a workpiece (1), the method comprising the steps:
- establishing a mechanical contact between a contact element and the layer (2) on the surface for removing parts (13) of the layer (2);
- physical separating of removed parts (13) of the layer (2) from the parts of the layer (2) remaining on the surface of the workpiece (1).
Method for removing parts of a layer (2) on a surface of a workpiece (1), the method comprising the steps:
- generating a fluid flow, preferred at an angle between 1° and 90° with respect to the layer (2), for removing parts (13) of the layer (2);
- physical separating of removed parts (13) of the layer (2) from the parts of the layer (2) remaining on the surface of the workpiece (1).
Dependencies are inferred from the claim text.