Metal base substrate
AssigneeMitsubishi Materials Corporation
InventorsFumiaki Ishikawa, Kazuhiko Yamasaki
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Abstract
A metal base substrate includes a metal substrate (10), an insulating layer (20), and a metal foil (40) which are laminated in this order, wherein the metal base substrate further includes an adhesive layer (30) between the insulating layer (20) and the metal foil (40), and the adhesive layer (30) satisfies Expressions (1) to (3), in which E represents a Young's modulus at 25° C. having a unit of GPa, T represents a thickness having a unit of μm, and λ represents a thermal conductivity in a thickness direction having a unit of W/mK, E≤1 (1) 5≤T/E (2) T/λ<20. (3)
Claims2
A metal base substrate comprising a metal substrate, an insulating layer, and a metal foil which are laminated in this order,
- wherein the metal base substrate further comprises an adhesive layer between the insulating layer and the metal foil, and
- the adhesive layer satisfies Expressions (1) to (3), in which E represents a Young's modulus at 25° C. having a unit of GPa, T represents a thickness having a unit of and λ represents a thermal conductivity in a thickness direction having a unit of W/mK,
- E≤1 (1)
- 5≤T/E (2)
- T/λ<20. (3)
Dependencies are inferred from the claim text.