Bonding Method

Abstract

A bonding method is capable of firmly bonding a greater variety of materials using an electrochemical reaction. The bonding method includes a placement step of placing an oxygen ion conductor and a conductive member that includes an oxide layer on a surface thereof in contact with each other via the oxide layer, a connection step of connecting the oxygen ion conductor to the positive electrode side of a voltage application device and connecting the conductive member to the negative electrode side of the voltage application device, and a voltage application step of applying voltage between the oxygen ion conductor and the conductive member to bond the oxygen ion conductor and the conductive member.

Dependencies are inferred from the claim text.