End point detection method, polishing apparatus, and polishing method
AssigneeEbara Corporation
InventorsTaro Takahashi, Yuta Suzuki
Life of this patent
Estimating the term…
Loading patent…
AssigneeEbara Corporation
InventorsTaro Takahashi, Yuta Suzuki
Estimating the term…
An end point detection method is provided for detecting and end point based on a drive current supplied to a drive unit that rotates and drives one of a polishing table and a holding unit. The end point detection method includes: a step (S102) of determining whether a polishing condition of a polishing process to be executed coincides with a preset specific polishing condition; a step (S103) of adjusting a current control parameter in a drive control unit that controls the drive current, the current control parameter related to a change in the drive current with respect to a change in a driving load of the drive unit, if it is determined that the polishing condition coincides with the specific polishing condition; and a step (S105) of detecting the drive current supplied to the drive unit based on the adjusted current control parameter.
An end point detection method based on a drive current supplied to a drive unit that rotates and drives one of a polishing table that holds a polishing pad and a holding unit that holds a polishing target and presses the polishing target against a polishing pad, the end point detection method comprising:
A polishing apparatus comprising:
Dependencies are inferred from the claim text.