Apparatus and method for processing substrate

An apparatus for processing a substrate, the apparatus comprising:

• a support unit configured to support the substrate including a film to be removed;
• a laser generation unit configured to generate a laser beam to process the film to be removed;
• a beam splitter configured to split the laser beam emitted from the laser generation unit and guided to the beam splitter into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate;
• a first beam shaping unit provided on the first path and configured to shape the first laser beam;
• a second beam shaping unit provided on the second path and configured to shape the second laser beam;
• a first beam scanning unit provided downstream of the first beam shaping unit on the first path and configured to apply the first laser beam to the upper edge of the substrate in the manner of scanning;
• and
• a second beam scanning unit provided downstream of the second beam shaping unit on the second path and configured to apply the second laser beam to the lower edge of the substrate in the manner of scanning,
• wherein a beam shape of the first laser beam shaped by the first beam shaping unit differs from a beam shape of the second laser beam shaped by the second beam shaping unit.