Film removing method, substrate treating method, and substrate treating apparatus
AssigneeSemes Co., Ltd.
InventorsSoo Young PARK, Ohyeol KWON, Jun Keon AHN, Jung Hwan LEE, Seong Soo LEE
Life of this patent
Estimating the term…
Abstract
Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.
Claims10
-16. (canceled)
An apparatus for treating a substrate, the apparatus comprising:
- a housing having an inner space;
- a support unit received in the inner space for supporting and rotating the substrate;
- a laser irradiation unit for irradiating a plurality of unit pulse laser beams onto the substrate supported on the support unit;
- and
- a controller to control the support unit and the laser irradiation unit,
- wherein the controller is configured to:
- control the support unit to rotate the substrate supported on the support unit;
- control a combination of the support unit and the laser irradiation unit to perform a first irradiation operation for irradiating a plurality of unit pulse laser beams to the substrate while the substrate is rotating, wherein in the first irradiation operation, a pulse width of each of the unit pulse laser beams is set so that regions of the substrate onto which the unit pulse laser beams are irradiated respectively do not overlap each other;
- and
- control a combination of the support unit and the laser irradiation unit to perform a second irradiation operation for irradiating a plurality of unit pulse laser beams to the substrate while the substrate is rotating, wherein in the second irradiation operation, the unit pulse laser beams are respectively irradiated onto regions between adjacent regions among the regions receiving the unit pulse laser beams respectively in the first irradiation operation.
Dependencies are inferred from the claim text.