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US 2020/0346299 A1Published application
Apparatus and method for treating substrate
AssigneeSemes Co., Ltd.
InventorsSoo Young PARK, Ohyeol KWON, Jun Keon AHN, Jung Hwan LEE
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Abstract
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a space in which a substrate is treated, a support unit supporting the substrate inside the chamber, a laser unit irradiating laser to an edge region of the substrate, a vision unit capturing the edge region of the substrate to measure an offset value of the substrate, and an adjustment unit adjusting an irradiation location of the laser based on the offset value of the substrate.
Claims8
A substrate treating apparatus comprising:
- a chamber configured to provide a space in which a substrate is treated;
- a support unit configured to support the substrate inside the chamber;
- a laser unit configured to irradiate laser to an edge region of the substrate;
- a vision unit configured to capture the edge region of the substrate to measure an offset value of the substrate;
- and
- an adjustment unit configured to adjust an irradiation location of the laser based on the offset value of the substrate.
3 more elements
Dependencies are inferred from the claim text.