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US 2020/0343085 A1Published application
Edge Shaping of Substrates
OwnerNirdesh Ojha, Roland Rupp +1inventors
InventorsNirdesh Ojha, Roland Rupp, Francisco Javier Santos Rodriguez
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Abstract
A method includes producing a bulk substrate and beveling an edge of the bulk substrate using an electrical discharge machining (EDM) process and/or an electrochemical discharge machining (ECDM) process.
Claims20
A method, comprising:
- producing a thinner substrate from a thicker bulk substrate;
- and
- processing an edge of the thinner substrate using an electrical discharge machining (EDM) process and/or an electrochemical discharge machining (ECDM) process.
A method, comprising:
- producing a bulk substrate;
- and
- beveling an edge of the bulk substrate using an electrical discharge machining (EDM) process and/or an electrochemical discharge machining (ECDM) process.
Dependencies are inferred from the claim text.