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US 2020/0338654 A1Published application
High throughput bandsaw
AssigneeKimberly-Clark Worldwide, Inc.
InventorsRobert E. Krautkramer, Matthew R. Wilson, Matthew J. Maigatter, John Andrew W. Markel, James L. Baggot
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Abstract
The present disclosure provides for an apparatus for using continuous, preferably smooth, bandsaw blades to cut a substrate. The current disclosure also discloses using the same for preparing a safe and efficient method for cutting substrates into rolls.
Claims20
A cutting apparatus for cutting flexible substrates having a longitudinal axis, the apparatus comprising:
- a frame having an upper surface lying in a first plane;
- one or more pulleys attached to the frame;
- one or more motors for driving one or more pulleys;
- an endless stationary bandsaw blade mountably engaged with one or more pulleys and arranged to define at least one cutting lane, the bandsaw blade having an upper and lower edge;
- and
- a moveable carriage for receiving and advancing the substrate through a cutting lane thereby cutting the substrate along a plane which is orthogonal to the longitudinal axis of the substrate.
3 more elements
(canceled)
A method for cutting flexible substrates having a longitudinal axis, the method comprising:
- depositing and holding the substrate into a moveable carriage;
- rotating the moveable carriage with a motor;
- a motor for driving one or more pulleys through one or more cutting lanes wherein the pulleys move an endless stationary bandsaw blade;
- continuously cutting the substrates at the same location during each pass with the bandsaw blade;
- and optionally
- sharpening the bandsaw blade with a sharpening blade tool while cutting the substrates.
3 more elements
Dependencies are inferred from the claim text.