Method and apparatus for angled etching
OwnerJohn M. WHITE, Yang YANG +3inventors
InventorsJohn M. WHITE, Yang YANG, Kartik RAMASWAMY, Manivannan THOTHADRI, Yue GUO
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OwnerJohn M. WHITE, Yang YANG +3inventors
InventorsJohn M. WHITE, Yang YANG, Kartik RAMASWAMY, Manivannan THOTHADRI, Yue GUO
Estimating the term…
Embodiments described herein relate to apparatus and methods for performing electron beam reactive plasma etching. In one embodiment, an apparatus for performing EBRPE processes includes an electrode formed from a material having a high secondary electron emission coefficient. The electrode has an electron emitting surface disposed at a nonparallel angle relative to a major axis of a substrate assembly. The EBRPE apparatus may further comprise a capacitive or inductive coupled plasma generator. In another embodiment, methods for etching a substrate include generating a plasma and bombarding an electrode with ions from the plasma to cause the electrode to emit electrons. The electrons are accelerated toward a substrate to induce directional etching of the substrate. During the EBPRE process, the substrate or electrode is actuated through a process volume during the etching.
A chamber for electron beam etching, comprising:
A movable electrode assembly for electron beam etching, comprising:
(canceled)
Dependencies are inferred from the claim text.