Chip package structure
OwnerShih-Chi Cheninventor
Life of this patent
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Abstract
A chip package structure, comprises a first chip having a plurality of first chip joints at a lower side thereof; a circuit board below the first chip; an upper side of the circuit board being arranged with a plurality of circuit board joints; in packaging, the first chip joints being combined with the circuit board joints of the circuit board so that the first chip is combined to the circuit board by a way of ACF combination or convex joint combination; and wherein in the ACF combination, ACFs are used as welding points to be combined to the pads at another end so that the chip is combined to the circuit board; and wherein in the convex pad combination, a convex pad is combined with a flat pad by chemically methods or physical methods; and these pads are arranged on the circuit board and the first chip.
Claims6
A chip package structure, comprising:
- a first chip (10) having a plurality of first chip joints (11) at a lower side thereof;
- a circuit board (20) below the first chip;
- an upper side of the circuit board (20) being arranged with a plurality of circuit board joints (21) at positions corresponding to those of the first chip joints of the first chip;
- in packaging, the first chip joints being combined with the circuit board joints of the circuit board so that the first chip is combined to the circuit board by a way of ACF (anisotropic conductive film) combination or convex joint combination;
- and
- wherein in the ACF combination, ACFs are used as welding points to be combined to the pads at another end so that the chip is combined to the circuit board;
- and
- wherein in the convex pad combination, a convex pad is combined with a flat pad by chemically methods or physical methods;
- and these pads are arranged on the circuit board and the first chip.
Dependencies are inferred from the claim text.