Package for food product
AssigneeNestec S.A.
InventorSumeet Dhawan
Life of this patent
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Abstract
The present invention relates to a package for heating a food in a solid state microwave oven and a method for heating a food in a solid state microwave oven. Particularly, the package comprises a tray and a susceptor, characterized in that there is a thermal insulation between the susceptor and a food to be placed in the tray.
Claims19
A package for heating a food in a solid state microwave oven, the package comprising a tray and a susceptor, wherein the susceptor is integrated or attached to a bottom of the tray and covers a part of the surface of the bottom of the tray, characterized in that and there is a thermal insulation between the susceptor and the food to be placed in the tray.
Method for heating a food in a solid state microwave oven comprising the step of placing a food into a package for heating a food in a solid state microwave oven, the package comprising a tray and a susceptor, wherein the susceptor is integrated or attached to a bottom of the tray and covers a part of the surface of the bottom of the tray, and there is a thermal insulation between the susceptor and the food to be placed in the tray, and heating the food or parts thereof in a solid state microwave oven at a selected frequency of between 900 and 5800 MHz.
Dependencies are inferred from the claim text.