Semiconductor module and manufacturing method therefor
AssigneeFuji Electric Co., Ltd.
InventorsTakafumi YAMADA, Hiromichi GOHARA
Life of this patent
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Abstract
A semiconductor module is provided, including: a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to the upper surface electrode; a metal wiring plate electrically connected to the upper surface electrode of the semiconductor chip; and a sheet-like low elastic sheet provided on the metal wiring plate, the low elastic sheet having elastic modulus lower than that of the metal wiring plate. A manufacturing method for a semiconductor module is provided, including: providing a semiconductor chip; solder-bonding a metal wiring plate above said semiconductor chip; and applying a sheet-like low elastic sheet having the elastic modulus lower than that of said metal wiring plate to said metal wiring plate.
Claims16
A semiconductor module comprising:
- a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to said upper surface electrode;
- a metal wiring plate electrically connected to said upper surface electrode of said semiconductor chip;
- and
- a sheet-like low elastic sheet provided on said metal wiring plate, said low elastic sheet having elastic modulus lower than that of said metal wiring plate.
A manufacturing method for a semiconductor module, comprising:
- providing a semiconductor chip;
- solder-bonding a metal wiring plate above said semiconductor chip;
- and
- applying a sheet-like low elastic sheet having the elastic modulus lower than that of said metal wiring plate to said metal wiring plate.
Dependencies are inferred from the claim text.