# US 2020/0288608 A1 · Shield package

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- Number: US 2020/0288608 A1
- Document ID: US20200288608A1
- Status: Published application
- Kind: A1
- Application number: 16/753,864
- Filed: 2018-09-27
- Published: 2020-09-10
- Earliest claimed: 2017-10-13
- Assignees: Tatsuta Electric Wire & Cable Co., Ltd.
- Applicants: Tatsuta Electric Wire & Cable Co., Ltd.
- Inventors: Hiroaki Umeda; Kazuhiro Matsuda; Hajime Nakazono; Hidetoshi Noguchi
- Web page: https://patentgrep.com/patent/US20200288608A1

## CPC

- H10W 74/014: {using batch processing}
- C08G 59/4042: {Imines; Imides}
- C08G 59/621: {Phenols}
- C09D 5/24: Electrically-conducting paints {(conductive materials H01B1/00)}
- C09D 7/61: inorganic
- C09D 7/70: {characterised by shape, e.g. fibres, flakes or microspheres}
- C09D 163/00: Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- H05K 5/065: {sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding}
- H05K 9/0024: {Shield cases mounted on a PCB, e.g. cans or caps or conformal shields}
- H05K 9/0083: {comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers (H05K9/0086 takes precedence)}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/473: {containing a filler}
- C08K 2003/0806: {Silver}
- C08K 2003/085: {Copper}
- C08K 2201/003: Additives being defined by their diameter
- C08K 2201/014: Additives containing two or more different additives of the same subgroup in C08K
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 μm to 50 μm, and a radical polymerization initiator.

## Claims

### Claim 1

A shield package, characterized by comprising:
a package in which an electronic component is mounted on a substrate, and the electronic component is sealed with a sealing material; and
a shield layer including a first layer and a second layer that are sequentially laminated on the package,
wherein the first layer made from a conductive resin composition in which
(A) 100 parts by mass of a binder component containing 5 parts by mass to 30 parts by mass of a solid epoxy resin that is a solid at a normal temperature and 20 parts by mass to 90 parts by mass of a liquid epoxy resin that is a liquid at a normal temperature in a range not exceeding a total amount of 100 parts by mass,
(B) 400 parts by mass to 1800 parts by mass of metal particles, and
(C) 0.3 part by mass to 40 parts by mass of a curing agent are contained,
the metal particles (B) include at least (B1) spherical metal particles and (B2) flaky metal particles, and
a content ratio of the spherical metal particles (B1) to the metal particles (B) is 20 mass % to 80 mass %,
the second layer made from a conductive resin composition in which
a binder component containing (D) a (meth)acrylic resin having a weight average molecular weight of 1000 or more and 400000 or less and (E) a monomer having a glycidyl group and/or a (meth)acryloyl group in molecules,
(F) metal particles having an average particle diameter of 10 nm to 500 nm,
(G) metal particles having an average particle diameter of 1 μm to 50 μm, and
(H) a radical polymerization initiator are contained,
a total content of the metal particles (F) and the metal particles (G) is 2000 parts by mass to 80000 parts by mass with respect to 100 parts by mass of the binder component of the second layer, and
a content ratio of the metal particles (F) to a total amount of the metal particles (F) and the metal particles (G) is 8 mass % to 85 mass %.

### Claim 2 (depends on 1)

The shield package according to claim 1, characterized in that the binder component (A) further contains a monomer having a (meth)acryloyl group in molecules.

### Claim 3 (depends on 1)

The shield package according to claim 1, characterized in that the monomer (E) is a monomer having a glycidyl group and a (meth)acryloyl group in molecules.

### Claim 4 (depends on 1)

The shield package according to claim 1, characterized in that the metal particles (G) are at least one type selected from the group consisting of copper particles, silver-coated copper particles, and silver-coated copper alloy particles.

### Claim 5 (depends on 2)

The shield package according to claim 2, characterized in that the monomer (E) is a monomer having a glycidyl group and a (meth)acryloyl group in molecules.

### Claim 6 (depends on 2)

The shield package according to claim 2, characterized in that the metal particles (G) are at least one type selected from the group consisting of copper particles, silver-coated copper particles, and silver-coated copper alloy particles.

### Claim 7 (depends on 3)

The shield package according to claim 3, characterized in that the metal particles (G) are at least one type selected from the group consisting of copper particles, silver-coated copper particles, and silver-coated copper alloy particles.