# US 2020/0288607 A1 · Minimizing or alleviating stress in a surface of a sheet metal structure caused by addition of surface features to the structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0288607 A1 - Document ID: US20200288607A1 - Status: Published application - Kind: A1 - Application number: 16/291,715 - Filed: 2019-03-04 - Published: 2020-09-10 - Earliest claimed: 2019-03-04 - Assignees: Cisco Technology, Inc. - Applicants: Cisco Technology, Inc. - Inventors: Vic Hong Chia; Perry L. Hayden, SR.; Paul Matthew Plummer - Web page: https://patentgrep.com/patent/US20200288607A1 ## CPC - B21D 17/00: Forming single grooves in sheet metal or tubular or hollow articles - H05K 9/0026: {integrally formed from metal sheet} - B21D 28/26: in sheets or flat parts - B21D 51/52: boxes, cigarette cases, or the like - C21D 9/46: for sheet metals - C21D 10/00: Modifying the physical properties by methods other than heat treatment or deformation - B21D 22/02: Stamping using rigid devices or tools - B21D 28/02: Punching blanks or articles with or without obtaining scrap (cutting nails or pins from strips or sheet material B21G3/26); Notching - C21D 2221/00: Treating localised areas of an article - C21D 2261/00: Machining or cutting being involved - B21D: WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire B21F) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C21D: MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass C23F17/00; unidirectional solidification of eutectic materials or unidirectional demixing of eutectoid materials C30B) ## Abstract Formation of a deformation along a surface of a sheet metal panel of an electronic device is minimized or prevented by determining an area of the surface to which a deformation has developed or is predicted to develop, where the deformation forms or is predicted to form in response to one or more of the surface features being provided into the surface. A score line is provided along the surface that is at or proximate the area. ## Claims ### Claim 1 A method of minimizing stress within a sheet metal panel of an electronic device, the method comprising: providing a plurality of surface features into a surface of the sheet metal panel; determining an area of the surface that includes a deformation, wherein the deformation forms in response to one or more of the surface features being provided into the surface; and providing a score line along the surface that is at or proximate the area. ### Claim 2 (depends on 1) The method of claim 1, wherein each surface feature of the plurality of surface features comprises an embossment, a tab, an opening, a vent, a louver or a slot. ### Claim 3 (depends on 1) The method of claim 1, further comprising: providing a further score line that is at or proximate the area in response to observing that the deformation has not been reduced to a determined size after providing the score line. ### Claim 4 (depends on 1) The method of claim 1, wherein the score line extends at least partially through the area. ### Claim 5 (depends on 1) The method of claim 1, wherein the score line extends between at least two surface features of the plurality of surface features. ### Claim 6 (depends on 1) The method of claim 1, wherein the sheet metal panel has a thickness ranging from about 0.6 mm to about 1.2 mm. ### Claim 7 (depends on 1) The method of claim 1, wherein the score line has a depth that is no greater than about half a thickness of the sheet metal panel. ### Claim 8 (depends on 1) The method of claim 1, wherein the score line has a depth that is no greater than about ⅓ a thickness of the sheet metal panel. ### Claim 9 (depends on 1) The method of claim 1, wherein the score line has a width that decreases in cross-sectional dimension as a depth of the score line increases within the surface of the sheet metal panel. ### Claim 10 (depends on 1) The method of claim 1, wherein at least one of the surface features is configured to connect with an electronic component. ### Claim 11 (depends on 10) The method of claim 10, wherein the electronic component comprises a printed circuit board assembly (PCBA). ### Claim 12 (depends on 11) The method of claim 11, wherein the electronic device comprises a server. ### Claim 13 A method of minimizing or preventing formation of a deformation along a surface of a sheet metal panel of an electronic device, the method comprising: determining an area of the surface to which a deformation has developed or is predicted to develop, wherein the deformation forms or is predicted to form in response to one or more surface features being provided into the surface; and providing a score line along the surface that is at or proximate the area. ### Claim 14 (depends on 13) The method of claim 13, further comprising: providing a plurality of surface features into the surface of the sheet metal panel prior to providing the score line along the surface. ### Claim 15 (depends on 13) The method of claim 13, further comprising: providing a plurality of surface features into the surface of the sheet metal panel subsequent to providing the score line along the surface. ### Claim 16 (depends on 15) The method of claim 15, wherein each surface feature of the plurality of surface features comprises an embossment, a tab, an opening, a vent, a louver or a slot. ### Claim at position 17 17-20. (canceled) ### Claim 21 (depends on 13) The method of claim 13, wherein the score line extends at least partially through the area. ### Claim 22 (depends on 13) The method of claim 13, wherein the score line extends between at least two surface features being provided into the surface. ### Claim 23 (depends on 13) The method of claim 13, wherein at least one of the surface features is configured to connect with an electronic component. ### Claim 24 (depends on 23) The method of claim 23, wherein the electronic component comprises a printed circuit board assembly (PCBA).