# US 2020/0288604 A1 · Heat dissipation structure

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- Number: US 2020/0288604 A1
- Document ID: US20200288604A1
- Status: Published application
- Kind: A1
- Application number: 16/792,947
- Filed: 2020-02-18
- Published: 2020-09-10
- Earliest claimed: 2019-03-04
- Assignees: ASUSTeK COMPUTER INC.
- Applicants: Asustek Computer Inc.
- Inventors: Chun-Chieh WONG; Cheng-Yu WANG
- Web page: https://patentgrep.com/patent/US20200288604A1

## CPC

- H05K 7/20454: {with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste}
- H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps}
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 40/73: for cooling by change of state
- G06F 1/20: Cooling means
- H10W 40/611: {Bolts or screws}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.

## Claims

### Claim 1 (depends on 1)

A heat dissipation structure, applied to a substrate with a heat generating element, comprising:
a heat dissipation body, having a connecting portion, wherein the connecting portion comprises a central area and a peripheral area, and the central area is configured to contact with the heat generating element;
an elastomer, disposed between the peripheral area and the heat generating element, to form a sealed space, wherein the sealed space is configured to accommodate a heat-conducting medium. The heat dissipation structure according to claim 1, wherein the heat generating element comprises a protrusion, and the central area is corresponding to the protrusion.

### Claim 3 (depends on 1)

The heat dissipation structure according to claim 1, wherein a thickness of the central area is greater than a thickness of the peripheral area.

### Claim 4 (depends on 1)

The heat dissipation structure according to claim 1, wherein a thickness of the central area is equal to a thickness of the peripheral area.

### Claim 5 (depends on 1)

The heat dissipation structure according to claim 1, wherein the elastomer comprises a first portion contacting with the heat generating element and a second portion extending beyond an edge of the heat generating element.

### Claim 6 (depends on 5)

The heat dissipation structure according to claim 5, wherein the second portion extends along an outer surface of the heat generating element to the substrate.

### Claim 7 (depends on 1)

The heat dissipation structure according to claim 1, wherein the heat dissipation body further comprises a heat pipe.

### Claim 8 (depends on 1)

The heat dissipation structure according to claim 1, wherein the elastomer comprises foam. rubber, silica gel or the combination of thereof.