# US 2020/0288603 A1 · Arrangement for dissipating heat of a power supply unit in a housing

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- Number: US 2020/0288603 A1
- Document ID: US20200288603A1
- Status: Published application
- Kind: A1
- Application number: 16/811,646
- Filed: 2020-03-06
- Published: 2020-09-10
- Earliest claimed: 2019-03-08
- Assignees: Appleton Grp LLC
- Applicants: Appleton Grp LLC
- Inventors: Santosh K. Patil; Timothy E. Graff
- Web page: https://patentgrep.com/patent/US20200288603A1

## CPC

- H05K 7/20418: {the radiating structures being additional and fastened onto the housing}
- H05K 7/2049: {Pressing means used to urge contact, e.g. springs}
- F21V 23/009: {the casing being inside the housing of the lighting device}
- F21V 29/508: of electrical circuits
- F21V 29/713: {in direct thermal and mechanical contact of each other to form a single system}
- F21V 29/76: with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- H01M 10/613: Cooling or keeping cold
- H01M 10/6551: Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
- F21Y 2115/10: Light-emitting diodes [LED]
- Y02E 60/10: Energy storage using batteries
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

The present disclosure envisages an arrangement (100) for dissipating heat of a power supply unit (105) in a housing (110). The arrangement (100) comprises at least one packing member (120). The packing member (120) is disposed between the power supply unit (105) and an operative inner wall of the housing (110) to increase conductive thermal contact between inner walls of the housing (110) and the power supply unit (105). The arrangement (100) facilitates maximum surface contact between a power supply unit and inner walls of a housing.

## Claims

### Claim 1

An arrangement for dissipating heat of a power supply unit in a housing, said arrangement comprising at least one packing member slid between said power supply unit and an operative inner wall of said housing, said arrangement configured to increase conductive thermal contact between at least some of the inner walls of said housing and said power supply unit.

### Claim 2 (depends on 1)

The arrangement as claimed in claim 1, wherein said packing member is thermally conductive.

### Claim 3 (depends on 1)

The arrangement as claimed in claim 1, wherein said packing member is a slab of constant cross-section.

### Claim 4 (depends on 1)

The arrangement as claimed in claim 1, wherein said packing member is a wedge.

### Claim 5 (depends on 4)

The arrangement as claimed in claim 4, wherein said arrangement includes at least one cavity configured on said wedge.

### Claim 6 (depends on 4)

The arrangement as claimed in claim 4, wherein the tapered angle of said wedge ranges from 1° to 10°.

### Claim 7 (depends on 4)

The arrangement as claimed in claim 4, wherein said wedge has chamfered edges.

### Claim 8 (depends on 4)

The arrangement as claimed in claim 4, wherein said wedge comprises screw lugs provided on opposite sides thereof to fasten said wedge to said housing.

### Claim 9 (depends on 4)

The arrangement as claimed in claim 4, wherein said arrangement comprises a first tapered inner wall and a second tapered inner wall configured in said housing, said first tapered inner wall is configured opposite to said second tapered inner wall abutting said packing member.

### Claim 10 (depends on 9)

The arrangement as claimed in claim 9, wherein said arrangement comprises a third tapered inner wall configured in said housing, said third tapered inner wall is orthogonal to said first tapered inner wall and said second inner wall, and said arrangement is configured to increase conductive thermal contact between said power supply unit and said first, second and third tapered walls.

### Claim 11 (depends on 9)

The arrangement as claimed in claim 9, wherein tapered angle of said first tapered inner wall is equal to the taper angle of said wedge.

### Claim 12 (depends on 1)

The arrangement as claimed in claim 1, wherein said arrangement includes a pair of guiding channels configured on an operative inner wall of said housing to guide said power supply unit in said housing.

### Claim 13 (depends on 1)

The arrangement as claimed in claim 1, wherein said arrangement includes a plurality of fins configured on an operative outer surface of said housing.

### Claim 14

A method of dissipating heat of a power supply unit in a housing, said method comprising the step of inserting a packing member between an inner wall of said housing and said power supply unit to increase conductive thermal contact between inner walls of said housing and said power supply unit.

### Claim 15 (depends on 14)

The method as claimed in claim 14, wherein said method comprises the step of securing said packing member within said housing via fasteners.