# US 2020/0288578 A1 · Base material for printed circuit board and printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0288578 A1 - Document ID: US20200288578A1 - Status: Published application - Kind: A1 - Application number: 16/648,391 - Filed: 2018-07-09 - Published: 2020-09-10 - Earliest claimed: 2017-10-16 - Assignees: Sumitomo Electric Industries, Ltd.; Sumitomo Electric Printed Circuits, Inc. - Applicants: Sumitomo Electric Industries, Ltd.; Sumitomo Electric Printed Circuits, Inc. - Inventors: Kazuhiro MIYATA; Takashi KASUGA; Yoshio OKA; Hiroshi UEDA - Web page: https://patentgrep.com/patent/US20200288578A1 ## CPC - C23C 28/023: {only coatings of metal elements only} - B22F 1/0545: Dispersions or suspensions of nanosized particles - B22F 7/08: with one or more parts not made from powder {(B22F7/062 takes precedence)} - C23C 18/1653: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating} - C23C 18/1696: {Control of atmosphere} - C23C 18/1698: {Control of temperature} - C23C 18/1844: {with use of organic or inorganic compounds other than metals, first} - C23C 18/38: Coating with copper - C23C 28/00: Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D - C23C 28/02: only coatings {only including layers} of metallic material - C25D 7/00: Electroplating characterised by the article coated - H05K 1/03: Use of materials for the substrate - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} - H05K 3/061: {Etching masks} - H05K 3/24: Reinforcing of the conductive pattern {(by solder coating H05K3/3465)} - H05K 3/38: Improvement of the adhesion between the insulating substrate and the metal - H05K 3/423: {characterised by electroplating method} - B22F 9/24: starting from liquid metal compounds, e.g. solutions - H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} - H05K 3/108: {by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)} - H05K 2201/0257: Nanoparticles - H05K 2203/072: Electroless plating, e.g. finish plating or initial plating - H05K 2203/0723: Electroplating, e.g. finish plating - H05K 2203/1131: Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A base material for a printed circuit board includes: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm. ## Claims ### Claim 1 A base material for a printed circuit board comprising: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm. ### Claim 2 (depends on 1) The base material for a printed circuit board according to claim 1, wherein an average particle size of the metal particles is greater than or equal to 1 nm and less than or equal to 500 nm. ### Claim 3 (depends on 1) The base material for a printed circuit board according to claim 1, wherein a main component of the sintered layer, the electroless plating layer, and the electroplating layer is copper. ### Claim 4 A printed circuit board comprising: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is found of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein the sintered layer, the electroless plating layer, and the electroplating layer are patterned in plan view, and wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm.