# US 2020/0288574 A1 · Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0288574 A1 - Document ID: US20200288574A1 - Status: Published application - Kind: A1 - Application number: 16/879,815 - Filed: 2020-05-21 - Published: 2020-09-10 - Earliest claimed: 2017-11-30 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Shingo ITO; Naoki GOUCHI - Web page: https://patentgrep.com/patent/US20200288574A1 ## CPC - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H01F 17/00: Fixed inductances of the signal type - H01F 27/29: Terminals; Tapping arrangements {for signal inductances} - H01G 4/228: Terminals - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - H05K 3/4617: {characterized by laminating only or mainly similar single-sided circuit boards} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H03H 1/00: Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network (constructional details of electromechanical transducers H03H9/00) - H03H 2001/0085: {Multilayer, e.g. LTCC, HTCC, green sheets} - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 1/162: {incorporating printed capacitors} - H05K 1/165: {incorporating printed inductors} - H05K 2201/0141: Liquid crystal polymer [LCP] - H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A multilayer substrate includes a stacked body including a first main surface, and a conductor pattern (including a mounting electrode provided on the first main surface, and a first auxiliary pattern provided on the first main surface). The stacked body includes a plurality of insulating base material layers made of a resin as a main material and stacked on one another. The first auxiliary pattern is located adjacent to or in a vicinity of the mounting electrode. The mounting electrode, in a plan view of the first main surface (when viewed in the Z-axis direction), is interposed between a different conductor pattern (the mounting electrode) and the first auxiliary pattern. ## Claims ### Claim 1 A multilayer substrate comprising: a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface; and a conductor pattern including: a mounting electrode provided on the main surface; and a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode; wherein the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern; and three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode. ### Claim 2 (depends on 1) The multilayer substrate according to claim 1, wherein the first auxiliary pattern includes a portion facing the mounting electrode; and the portion has a shape along an outer shape of the mounting electrode. ### Claim 3 (depends on 1) The multilayer substrate according to claim 1, wherein an area of the first auxiliary pattern is larger than an area of the mounting electrode. ### Claim 4 (depends on 1) The multilayer substrate according to claim 1, wherein a width of the first auxiliary pattern in a first direction that crosses the mounting electrode and the first auxiliary pattern is larger than a width of the mounting electrode in the first direction. ### Claim 5 (depends on 1) The multilayer substrate according to claim 1, wherein a distance between the mounting electrode and the first auxiliary pattern in a first direction that crosses the mounting electrode and the first auxiliary pattern is smaller than a width of the first auxiliary pattern in the first direction. ### Claim 6 (depends on 1) The multilayer substrate according to claim 1, wherein the mounting electrode, in the plan view of the main surface, includes a portion partially surrounded by only the first auxiliary pattern. ### Claim 7 (depends on 1) The multilayer substrate according to claim 1, wherein the conductor pattern includes: an inner layer pattern provided inside the stacked body; and a second auxiliary pattern provided inside the stacked body and surrounding the inner layer pattern in the plan view of the main surface. ### Claim 8 (depends on 7) The multilayer substrate according to claim 7, further comprising: an interlayer connection conductor provided inside the stacked body; wherein the first auxiliary pattern and the second auxiliary pattern are connected to each other through the interlayer connection conductor. ### Claim 9 (depends on 1) The multilayer substrate according to claim 1, further comprising: a protective layer provided on the main surface; wherein the protective layer, in the plan view of the main surface, does not overlap with the first auxiliary pattern. ### Claim 10 (depends on 1) The multilayer substrate according to claim 1, wherein the four directions of the mounting electrode, in the plan view of the main surface, are surrounded by the first auxiliary pattern. ### Claim 11 (depends on 1) The multilayer substrate according to claim 1, wherein the mounting electrode includes a plurality of mounting electrodes; the first auxiliary pattern includes a plurality of first auxiliary patterns; and the plurality of first auxiliary patterns are located adjacent to or in a vicinity of different mounting electrodes, respectively. ### Claim 12 A multilayer substrate mounting structure comprising: a multilayer substrate; and a mounting substrate on which the multilayer substrate is mounted, the mounting substrate including a mounting surface and a bonding electrode on the mounting surface; wherein the multilayer substrate includes: a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface; and a conductor pattern including: a mounting electrode provided on the main surface; and a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode; the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern; three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode; the first auxiliary pattern is not electrically connected to the bonding electrode; and the mounting electrode is electrically connected to the bonding electrode. ### Claim 13 (depends on 12) The multilayer substrate mounting structure according to claim 12, wherein the mounting substrate includes a portion of the mounting surface on which the bonding electrode is provided; the portion is a convex portion protruding farther than other portions; the mounting electrode and the bonding electrode face each other; and the multilayer substrate and the mounting substrate are connected to each other, and an insulating anisotropic conductive film is interposed between the multilayer substrate and the mounting substrate. ### Claim 14 A method of manufacturing a multilayer substrate including a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface; and a conductor pattern including: a mounting electrode provided on the main surface, and a first auxiliary pattern provided on the main surface, the method comprising: a conductor pattern forming step of forming the mounting electrode, and the first auxiliary pattern located adjacent to or in a vicinity of the mounting electrode, on a surface of an insulating base material layer defining and functioning as the main surface, among the plurality of insulating base material layers; and a stacked body forming step of forming the stacked body by stacking the plurality of insulating base material layers and heating and pressing the stacked insulating base material layers, after the conductor pattern forming step, wherein the mounting electrode is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern; and three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode. ### Claim 15 A method of manufacturing an electronic device including a multilayer substrate, and a mounting substrate including a mounting surface, and a bonding electrode on the mounting surface, wherein the multilayer substrate includes a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface; and a conductor pattern including a mounting electrode provided on the main surface; and a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode; the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern; and three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode, the method comprising: an anisotropic element placing step of placing an insulating anisotropic conductive film on a surface of the bonding electrode being a convex portion protruding than at least other portions of the mounting surface; a multilayer substrate placing step of stacking the multilayer substrate on the mounting surface of the mounting substrate so that the mounting electrode may face the bonding electrode while interposing the insulating anisotropic conductive film between the multilayer substrate and the mounting substrate, after the anisotropic element placing step; and a heating and pressing step of heating and pressing the multilayer substrate and the mounting substrate in a direction in which the multilayer substrate and the mounting substrate are stacked on each other and electrically connecting the mounting electrode and the bonding electrode, after the multilayer substrate placing step. ### Claim 16 (depends on 1) The multilayer substrate according to claim 1, wherein the first and second portions of the first auxiliary pattern are linear or substantially linear conductor patterns. ### Claim 17 (depends on 7) The multilayer substrate according to claim 7, wherein the inner layer pattern includes a rectangular or substantially rectangular loop-shaped conductor pattern. ### Claim 18 (depends on 7) The multilayer substrate according to claim 7, wherein a first end of the inner layer pattern is electrically connected to the mounting electrode; and a second end of the inner layer pattern is electrically connected to a second mounting electrode.