# US 2020/0288571 A1 · Multi-socket server assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0288571 A1 - Document ID: US20200288571A1 - Status: Published application - Kind: A1 - Application number: 16/294,277 - Filed: 2019-03-06 - Published: 2020-09-10 - Earliest claimed: 2019-03-06 - Assignees: Cisco Technology, Inc. - Applicants: Cisco Technology, Inc. - Inventors: Anant Thakar; Jayaprakash Balachandran; Daniel Bernard Hruska - Web page: https://patentgrep.com/patent/US20200288571A1 ## CPC - G06F 1/20: Cooling means - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 5/0269: {Card housings therefor, e.g. covers, frames, PCB} - H05K 5/0291: {for multiple cards} - H05K 7/1487: {Blade assemblies, e.g. blade cases or inner arrangements within a blade} - H05K 7/20727: {within server blades for removing heat from heat source} - H05K 2201/10325: Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract In some examples, a printed circuit board assembly can include a printed circuit board having four (4) central processor unit (CPU) sockets disposed thereon and sixty four (64) dual in-line memory modules (DIMMs) disposed thereon. The printed circuit board can have a top surface and a bottom surface with two (2) CPU sockets and thirty two (32) DIMMs disposed on the top surface and two (2) CPU sockets and thirty two (32) DIMMs disposed on the bottom surface. ## Claims ### Claim 1 A printed circuit board comprising: a top surface and a bottom surface; a plurality of processor sockets disposed on the printed circuit board; a first plurality of dual in-line memory modules (DIMMs) disposed on the top surface; and a second plurality of DIMMs disposed on the bottom surface; wherein a first contact area of each DIMM in the first plurality of DIMMs and a second contact area of each DIMM in the second plurality of DIMMs have a respective overlapping alignment along a vector that is perpendicular to a plane of the printed circuit board, wherein each pair of DIMMs associated with the first contact area and the second contact area having the respective overlapping alignment is connected to a respective processor through a single via. ### Claim 2 (depends on 1) The printed circuit board of claim 1, wherein each pair of DIMMs comprises a first DIMM and a second DIMM having the first contact area and the second contact area with the respective overlapping alignment. ### Claim 3 (depends on 2) The printed circuit board of claim 2, wherein each processor socket is coupled with one or more pairs of DIMMs comprise a number of DIMMs disposed on the top surface and the number of DIMMs disposed on the bottom surface. ### Claim 4 (depends on 2) The printed circuit board of claim 2, wherein each pair of DIMMs is coupled with the respective processor socket by a single channel. ### Claim 5 (depends on 1) The printed circuit board of claim 1, wherein one or more processor sockets disposed on the top surface are longitudinally displaced from one or more processor sockets disposed on the bottom surface. ### Claim 6 (depends on 1) The printed circuit board of claim 1, wherein one or more processor sockets disposed on the top surface are laterally displaced from one or more other processor sockets and one or more processor sockets disposed on the bottom surface are laterally displaced from one or more different processor sockets. ### Claim 7 (depends on 6) The printed circuit board of claim 6, wherein a cooling path extends longitudinally across the printed circuit board, thus laterally displaced processor sockets interact with the cooling path. ### Claim 8 (depends on 1) The printed circuit board of claim 1, wherein the plurality of processor sockets comprises at least 4 sockets, wherein the first plurality of DIMMs comprises at least 32 DIMMs and the second plurality of DIMMs comprises at least 32 DIMMs, the printed circuit board being housed in a 7 U housing. ### Claim 9 (depends on 1) The printed circuit board of claim 1, wherein each processor socket in the plurality of processor sockets has a plurality of high speed links, each high speed link coupling the processor socket with each remaining processor socket in the plurality of processor sockets. ### Claim 10 (depends on 1) The printed circuit board of claim 1, wherein each processor socket in the plurality of processor sockets has a plurality of high speed links and wherein each processor socket is coupled with each remaining processor socket in the plurality of processor sockets via two high speed links from the plurality of high speed links. ### Claim 11 A system assembly comprising: a housing; and a printed circuit board within the housing, the printed circuit board comprising: a top surface and a bottom surface; a plurality of processor sockets disposed on the printed circuit board; a first plurality of dual in-line memory modules (DIMMs) disposed on the top surface; and a second plurality of DIMMs disposed on the bottom surface; wherein a first contact area of each DIMM in the first plurality of DIMMs and a second contact area of each DIMM in the second plurality of DIMMs have a respective overlapping alignment along a vector that is perpendicular to a plane of the printed circuit board, wherein each set of DIMMs associated with the first contact area and the second contact area having the respective overlapping alignment is connected to a respective processor through a single via. ### Claim 12 (depends on 11) The system assembly of claim 11, wherein each set of DIMMs comprises a first DIMM and a second DIMM having the first contact area and the second contact area with the respective overlapping alignment. ### Claim 13 (depends on 12) The server system assembly of claim 12, wherein each processor socket is coupled with one or more sets of DIMMs comprising a number of DIMMs disposed on the top surface and the number of DIMMs disposed on the bottom surface. ### Claim 14 (depends on 12) The system assembly of claim 12, wherein each set of DIMMs is coupled with the respective processor socket by a single channel. ### Claim 15 (depends on 11) The system assembly of claim 11, wherein the first plurality of processor sockets on the top surface are longitudinally displaced from the second plurality of processor sockets on the bottom surface. ### Claim 16 (depends on 11) The system assembly of claim 11, wherein the first plurality of processor sockets on the top surface are laterally displaced from each other and the second plurality of processor sockets on the bottom surface are laterally displaced from each other. ### Claim 17 (depends on 16) The system assembly of claim 16, wherein a cooling path extends longitudinally across the printed circuit board, thus laterally displaced processor sockets interact with the cooling path. ### Claim 18 (depends on 11) The system assembly of claim 11, wherein each processor socket in the first plurality of processor sockets and in the second plurality of processor sockets has a plurality of high speed links, each high speed link coupling each processor socket with each remaining processor socket in the first plurality of processor sockets and the second plurality of processor sockets. ### Claim 19 (depends on 11) The system assembly of claim 11, wherein each processor socket in the first plurality of processor sockets and the second plurality of sockets has a plurality of high speed links, each two high speed links coupling the processor socket with each remaining processor socket in the first plurality of processor sockets and the second plurality of processor sockets. ### Claim 20 (depends on 11) The system assembly of claim 11, further comprising an airflow path arranged to pass over both the top surface and the bottom surface.