# US 2020/0288562 A1 · Electronic circuit device

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- Number: US 2020/0288562 A1
- Document ID: US20200288562A1
- Status: Published application
- Kind: A1
- Application number: 16/758,151
- Filed: 2018-07-18
- Published: 2020-09-10
- Earliest claimed: 2017-11-08
- Assignees: Sumitomo Electric Industries, Ltd.
- Applicants: Sumitomo Electric Industries, Ltd.
- Inventors: Yuusuke OKAGAWA
- Web page: https://patentgrep.com/patent/US20200288562A1

## CPC

- H02M 3/158: including plural semiconductor devices as final control devices for a single load
- H05K 1/0206: {by printed thermal vias}
- H02M 3/1588: {comprising at least one synchronous rectifier element (H02M3/1582, H02M3/1584 take precedence)}
- H05K 1/0265: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)}
- H02M 1/327: {against abnormal temperatures}
- H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H05K 1/0231: {Capacitors or dielectric substances}
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/0792: Means against parasitic impedance; Means against eddy currents
- H05K 2201/09336: Signal conductors in same plane as power plane
- H05K 2201/10053: Switch
- H05K 2201/10166: Transistor
- H05K 2201/10522: Adjacent components
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The electronic circuit device includes: a first wiring pattern which is formed on a first main surface of a circuit board, has circuit elements including a switching element and mounted along a predetermined direction, and includes a virtual shortest current path connecting the circuit elements to each other along the predetermined direction; a second wiring pattern which is formed on a second main surface, and includes an opposing current path that opposes an area where the virtual shortest current path is formed; vias electrically connecting the first and second wiring patterns; and vias for heat transfer, connecting a mount area for the switching elements on the first main surface with an area on a side of the opposing current path on the second main surface. The heat dissipation member is in contact with the second main surface.

## Claims

### Claim 1

An electronic circuit device provided with:
a multilayer circuit board having mounted thereon a plurality of circuit elements including a switching element to form a power conversion circuit, the multilayer circuit board having formed a wiring pattern electrically connecting the circuit elements to each other; and
a heat dissipation member being in contact with the multilayer circuit board,
the electronic circuit device comprising:
a first wiring pattern formed on a first main surface of the multilayer circuit board, the first wiring pattern having the plurality of circuit elements including the switching element, mounted thereon along a predetermined direction, the first wiring pattern including a virtual shortest current path connecting the circuit elements to each other along the predetermined direction;
a second wiring pattern formed on a surface of a specific layer including a second main surface opposing the first main surface, the second wiring pattern including an opposing current path that opposes an area where the virtual shortest current path is formed;
vias configured to electrically connect the first wiring pattern formed on the first main surface with the second wiring pattern formed on the surface of the specific layer; and
vias for heat transfer, configured to connect a mount area for the switching element on the first main surface with the second main surface, in an area on a side of the opposing current path, wherein
the heat dissipation member is in contact with the second main surface, and heat generated in the switching element is dissipated by the heat dissipation member through the vias for heat transfer.

### Claim 2 (depends on 1)

The electronic circuit device according to claim 1, wherein the vias for heat transfer are provided so as to be located at both side portions across the opposing current path.

### Claim 3 (depends on 1)

The electronic circuit device according to claim 1, wherein a wiring pattern for heat transfer is formed on either the first main surface or the second main surface so as to surround the vias for heat transfer.

### Claim 4 (depends on 1)

The electronic circuit device according to claim 1, wherein
the power conversion circuit is a synchronous rectification step-down regulator in which a capacitor is connected in parallel to a series circuit of a high-side switching element and a low-side switching element, and
the virtual shortest current path is a current path connecting the capacitor to the low-side switching element via the high-side switching element.

### Claim 5 (depends on 2)

The electronic circuit device according to claim 2, wherein a wiring pattern for heat transfer is formed on either the first main surface or the second main surface so as to surround the vias for heat transfer.

### Claim 6 (depends on 2)

The electronic circuit device according to claim 2, wherein
the power conversion circuit is a synchronous rectification step-down regulator in which a capacitor is connected in parallel to a series circuit of a high-side switching element and a low-side switching element, and
the virtual shortest current path is a current path connecting the capacitor to the low-side switching element via the high-side switching element.

### Claim 7 (depends on 3)

The electronic circuit device according to claim 3, wherein
the power conversion circuit is a synchronous rectification step-down regulator in which a capacitor is connected in parallel to a series circuit of a high-side switching element and a low-side switching element, and
the virtual shortest current path is a current path connecting the capacitor to the low-side switching element via the high-side switching element.

### Claim 8 (depends on 1)

The electronic circuit device according to claim 1, wherein the vias for heat transfer are provided so as to be located at least one of both side portions across the opposing current path.

### Claim 9 (depends on 1)

The electronic circuit device according to claim 1, wherein
the vias for heat transfer are formed in the mount area for the switching element, and
the opposing current path is formed to pass beside a back area of the mount area of the switching element.

### Claim 10

An electronic circuit device provided with:
a multilayer circuit board having mounted thereon a plurality of circuit elements including a switching element to form a power conversion circuit, the multilayer circuit board having formed a wiring pattern electrically connecting the circuit elements to each other; and
a heat dissipation member being in contact with the multilayer circuit board,
the electronic circuit device comprising:
a first wiring pattern formed on a first main surface of the multilayer circuit board, the first wiring pattern having the plurality of circuit elements including the switching element, mounted thereon along a predetermined direction, the first wiring pattern