# US 2020/0287352 A1 · Laser heating device for mounting led

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- Number: US 2020/0287352 A1
- Document ID: US20200287352A1
- Status: Published application
- Kind: A1
- Application number: 16/559,728
- Filed: 2019-09-04
- Published: 2020-09-10
- Earliest claimed: 2019-03-06
- Assignees: Asti Global Inc., Taiwan
- Applicants: Asti Global Inc., Taiwan
- Inventors: CHIEN-SHOU LIAO
- Web page: https://patentgrep.com/patent/US20200287352A1

## CPC

- H01S 5/2228: {quantum wells}
- H10W 72/071: {Connecting or disconnecting}
- B23K 1/0056: {soldering by means of beams, e.g. lasers, electron beams [EB]}
- F21V 19/0015: {Fastening arrangements intended to retain light sources}
- H01S 5/2216: {nitrides}
- H10W 72/0711: {Apparatus therefor}
- F21Y 2115/10: Light-emitting diodes [LED]
- H10H 20/01: Manufacture or treatment
- H10H 20/0364: {of interconnections}
- H10H 20/81: Bodies
- H10H 20/812: within the light-emitting regions, e.g. having quantum confinement structures
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 72/0198: {batch processes}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07178: {Means for aligning}
- H10W 72/07183: {Means for monitoring}
- H10W 72/072: {of bump connectors}
- H10W 72/07235: {Applying EM radiation, e.g. induction heating or using a laser}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A laser heating device for mounting LED includes: a carrier substrate, an optical module and a laser generation module. The carrier substrate for carrying a circuit substrate includes a plurality of conductive pads, a plurality of conductors, and a plurality of LED chips. The conductors are respectively disposed on the conductive pads, and each of the LED chips is disposed in at least two of the corresponding conductors. The optical module is disposed above the carrier substrate. The laser generation module is adjacent to the optical module to provide a laser source having a first predetermined range. The conductor is irradiated by the laser source to mount the LED chip, the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range, and the first predetermined range is greater than, less than or equal to the second predetermined range.

## Claims

### Claim 1

A laser heating device for mounting LED, comprising:
a carrier substrate for carrying a circuit substrate, wherein the circuit substrate includes a plurality of conductive pads, a plurality of conductors, and a plurality of LED chips, the conductors are respectively disposed on the conductive pads, and each of the LED chips is disposed on at least two of the corresponding conductors;
an optical module disposed above the carrier substrate; and
a laser generation module adjacent to the optical module so as to provide a laser source having a first predetermined range;
wherein the conductor is mounted onto the LED chip by the irradiation of the laser source, the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range, and the first predetermined range is greater than, less than, or equal to the second predetermined range.

### Claim 2 (depends on 1)

The laser heating device for mounting LED according to claim 1, wherein each of the LED chips includes an n-type conductive layer disposed in a stacked arrangement, a light-emitting layer passed through by the laser source and a p-type conductive layer; the n-type conductive layer is an n-type gallium nitride material layer or an n-type gallium arsenide material layer, and the light-emitting layer is a multi-quantum well structure layer, and the p-type conductive layer is a p-type gallium nitride material layer or a p-type gallium arsenide material layer; wherein the irradiation area of the laser source covers only one conductor or one of the LED chips, and the intensity of the laser source generated by the laser source generating module is adjustable; wherein the laser source does not pass through the circuit substrate but only passes through the LED chip.

### Claim 3 (depends on 1)

The laser heating device for mounting LED according to claim 1, wherein each of the LED chips includes a base layer disposed in a stacked arrangement, an n-type conductive layer, a light-emitting layer passed through by the laser source and a p-type conductive layer; the base layer is a sapphire base layer, the n-type conductive layer is an n-type gallium nitride material layer or an n-type gallium arsenide material layer, the light-emitting layer is a multi-quantum well structure layer, and the p-type conductive layer is a p-type gallium nitride material layer or a p-type gallium arsenide material layer; wherein the irradiation area of the laser source only covers one conductor or one LED chip, and the intensity of the laser source generated by the laser source generating module is adjustable; wherein the laser source does not pass through the circuit substrate but only passes through the LED chip.

### Claim 4 (depends on 1)

The laser heating device for mounting LED according to claim 1, further comprising: a pick and place module adjacent to the carrier substrate for placing each of the LED chips on at least two of the corresponding conductors; wherein the light from the light source laser source is projected through the LED chip onto the conductor to cure the conductor so that the LED chip is mounted onto the circuit substrate; wherein the first predetermined range has the same or different shape as the second predetermined range.

### Claim 5 (depends on 1)

The laser heating device for mounting LED according to claim 1, further comprising:
a temperature control module adjacent to the carrier substrate for detecting the temperature of the conductor so as to obtain a conductor temperature information; and
a control module electrically connected between the temperature control module and the laser generation module;
wherein, the control module adjusts the power output by the laser generation module according to the conductor temperature information.

### Claim 6

A laser heating device for mounting LED, comprising:
a circuit substrate for carrying a plurality of conductors, and a plurality of LED chips;
an optical module disposed above the carrier substrate; and
a laser generation module adjacent to the optical module so as to provide a laser source having a first predetermined range;
wherein, the conductor is mounted onto the LED chip by the irradiation of the laser source, the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range, and the first predetermined range is greater than, less than, or equal to the second predetermined range.

### Claim 7 (depends on 6)

The laser heating device for mounting LED according to claim 6, wherein each of the LED chips includes an n-type conductive layer disposed in a stacked arrangement, a light-emitting layer passed through by the laser source and a p-type conductive layer; the n-type conductive layer is an n-type gallium nitride material layer or an n-type gallium arsenide material layer, and the light-emitting layer is a multi-quantum well structure layer, and the p-type conductive layer is a p-type gallium nitride material layer or a p-type gallium arsenide material layer; wherein the irradiation area of the laser source covers only one conductor or one of the LED chips, and the intensity of the laser source generated by the laser source generating module is adjustable.

### Claim 8 (depends on 6)

The laser heating device for mounting LED according to claim 6, wherein each of the LED chips includes a base layer disposed in a stacked arrangement, an n-type conductive layer, a light-emitting layer passed through by the laser source and a p-type conductive layer; the base layer is a sapphire base layer, the n-type conductive layer is an n-type gallium nitride material layer or an n-type gallium arsenide material layer, the light-emitting layer is a multi-quantum well structure layer, and the p-type conductive layer is a p-type gallium nitride material layer or a p-type gallium arsenide material layer; wherein the irradiation area of the laser source only covers one conductor or one LED chip, and the intensity of the laser source generated by the laser source generating module is adjustable.

### Claim 9 (depends on 6)

The laser heating device for mounting LED according to claim 6, further comprising:
a temperature control module adjacent to the carrier substrate for detecting the temperature of the conductor so as to obtain a conductor temperature information; and
a control module electrically connected between the temperature control module and the laser generation module;
wherein the control module adjusts the power output by the laser generation module according to the conductor temperature information.

### Claim 10

A laser heating device for mounting LED, comprising:
a circuit substrate for carrying a plurality of conductors;
an optical module disposed above the carrier substrate;
a laser generation module adjacent to the optical module so as to provide a laser source having a first predetermined range;
a temperature control module adjacent to the carrier substrate for detecting the temperature of the conductor so as to obtain a conductor temperature information; and
a control module electrically connected between the temperature control module and the laser generation module;
wherein the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range, the first predetermined range is greater than, less than, or equal to the second predetermined range, and the first predetermined range has the same or different shape as the second predetermined range;
wherein the control module adjusts the power output by the laser generation module according to the conductor temperature information.