# US 2020/0287271 A1 · Antenna-in-package with better antenna performance > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0287271 A1 - Document ID: US20200287271A1 - Status: Published application - Kind: A1 - Application number: 16/884,064 - Filed: 2020-05-27 - Published: 2020-09-10 - Earliest claimed: 2017-10-27 - Assignees: Mediatek Inc. - Applicants: Mediatek Inc. - Inventors: Yen-Ju Lu; Wen-Chou Wu - Web page: https://patentgrep.com/patent/US20200287271A1 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 1/525: {between emitting and receiving antennas} - H01Q 9/26: with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength (resonant loop antennas H01Q7/00) - H01Q 21/062: {using dipole aerials; (H01Q21/067, H01Q21/068 take precedence)} - H01Q 21/12: Parallel arrangements of substantially straight elongated conductive units (travelling-wave antennas comprising transmission line loaded with transverse elements H01Q11/02; Yagi antennas H01Q19/30) - H10W 20/43: Layouts of interconnections - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 44/248: {for antennas} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/9413: {on encapsulations} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An Antenna-in-Package (AiP) includes an interface layer having at least an antenna layer and an insulating layer disposed under the antenna layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. An integrated circuit die is disposed on the interface layer. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region includes a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die. The feeding network, the first antenna element, and the second antenna element are coplanar. A plurality of solder balls is disposed on a surface of the interface layer. ## Claims ### Claim 1 An Antenna-in-Package (AiP), comprising: an interface layer comprising at least an antenna layer and an insulating layer disposed under the antenna layer, wherein the antenna layer comprises a first antenna region and a second antenna region spaced apart from the first antenna region; an integrated circuit die disposed on the interface layer, wherein the integrated circuit die is interposed between the first antenna region and the second antenna region, wherein the first antenna region comprises a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die, wherein the feeding network, the first antenna element, and the second antenna element are coplanar; and a plurality of solder balls disposed on a surface of the interface layer. ### Claim 2 (depends on 1) The AiP according to claim 1, wherein the first antenna region is used for transmitting signals and the second antenna region is used for receiving signals. ### Claim 3 (depends on 1) The AiP according to claim 1, wherein the interface layer comprises a substrate, an interconnection structure, a redistribution layer (RDL) structure, or an interposer substrate. ### Claim 4 (depends on 1) The AiP according to claim 1, wherein the AiP further comprises a ground reflector layer, wherein the antenna layer and the ground reflector layer are formed in two different metal layers, respectively, which are in different horizontal planes. ### Claim 5 (depends on 1) The AiP according to claim 1, wherein the integrated circuit die comprises an integrated circuit silicon die or a semiconductor chip that comprises relative functional circuits for transmitting and receiving millimeter-wave (mmW) or radio-frequency (RF) signals. ### Claim 6 (depends on 1) The AiP according to claim 1, wherein the first antenna element is disposed relatively farther away from the integrated circuit die and the second antenna element is disposed relatively closer to the integrated circuit die. ### Claim 7 (depends on 1) The AiP according to claim 1, wherein the first antenna element and the second antenna element are two folded dipole antenna elements arranged in parallel with each other. ### Claim 8 (depends on 1) The AiP according to claim 1, wherein the feeding network comprises two parallel feed lines. ### Claim 9 (depends on 1) The AiP according to claim 1, wherein the feeding network is divided into two integral portions: a longitudinal portion extending along the second direction and a lateral portion extending along the first direction. ### Claim 10 (depends on 9) The AiP according to claim 9, wherein two distal ends of the longitudinal portion are electrically coupled to the first antenna element and the second antenna element, respectively. ### Claim 11 (depends on 9) The AiP according to claim 9, wherein the lateral portion is integrally connected to the longitudinal portion and is electrically coupled to the integrated circuit die. ### Claim 12 (depends on 9) The AiP according to claim 9, wherein a distance L1 between the first antenna element and the lateral portion of the feeding network is greater than a distance L2 between the second antenna element and the lateral portion of the feeding network. ### Claim 13 (depends on 12) The AiP according to claim 12, wherein a difference between L1 and L2 is approximately equal to a half wavelength λg, wherein λg is the guided wavelength of electromagnetic radiation transmitted via the antenna layer. ### Claim 14 (depends on 1) The AiP according to claim 1, wherein the second antenna region has a layout that is mirror symmetric to a layout of the first antenna region. ### Claim 15 (depends on 1) The AiP according to claim 1 further comprising: a first annular guard ring provided around the first antenna region; and a second annular guard ring provided around the second antenna region, wherein the first annular guard ring continuously surrounds the first antenna region and the second annular guard ring continuously surrounds the second antenna region. ### Claim 16 (depends on 15) The AiP according to claim 15, wherein first annular guard ring and the second annular guard ring are coplanar with the first and second antenna elements. ### Claim 17 (depends on 1) The AiP according to claim 1 further comprising: a mesh type layout of ground ball pads around the first antennal region and the second antenna region.