# US 2020/0286933 A1 · Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0286933 A1 - Document ID: US20200286933A1 - Status: Published application - Kind: A1 - Application number: 16/651,455 - Filed: 2018-09-19 - Published: 2020-09-10 - Earliest claimed: 2017-09-28 - Assignees: Ningbo Sunny Opotech Co., Ltd. - Applicants: Ningbo Sunny Opotech Co., Ltd. - Inventors: Takehiko TANAKA; Bojie ZHAO; Zhewen MEI; Nan GUO - Web page: https://patentgrep.com/patent/US20200286933A1 ## CPC - H10F 39/8033: {Photosensitive area} - H10F 39/804: {Containers or encapsulations} - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H10F 39/8057: {Optical shielding} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof. ## Claims ### Claim at position 1 1-55. (canceled) ### Claim 56 A method for manufacturing a photosensitive assembly of a camera module, comprising following steps: fixing a circuit board jointed panel to a second die of a molding die, wherein the circuit board jointed panel includes one or more rows of circuit boards, and each row of the circuit boards includes one or more circuit boards arranged side by side, each of the circuit boards includes a rigid region and a flexible region combined with each other, and each of the circuit boards is operatively connected with a photosensitive element; clamping the second die and a first die, and filling a molten molding material in a base jointed panel molding guide groove in the molding die, wherein a position corresponding to at least one light window molding portion is prevented from filling with the molding material; and curing the molding material in the base jointed panel molding guide groove to form a one-piece molding base at a position corresponding to the base jointed panel molding guide groove, wherein the one-piece molding base is integrally molded on corresponding one or more rows of the circuit board and one or more rows of the photosensitive elements to form a photosensitive assembly jointed panel and forms a light window that provides a light path for each of the photosensitive elements at a position corresponding to the light window molding portion, wherein the base jointed panel molding guide groove has a first diversion groove corresponding to a first end side of the one-piece molding base adjacent to the flexible region and a second diversion groove corresponding to the one-piece molding base away from the flexible region, and a plurality of the filling grooves extending between the first diversion groove and the second diversion groove, wherein the first diversion groove has a first side surface facing the light window, the second diversion groove has a second side surface facing the light window, wherein the first side surface includes a first partial surface provided adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and the second side surface has a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface relative to an optical axis of the camera module is greater than a second angle of the second partial surfaces relative to the optical axis, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis. ### Claim 57 (depends on 56) The method according to claim 56, further comprising a step of: cutting the photosensitive assembly jointed panel to obtain a plurality of photosensitive assemblies, wherein each of the photosensitive assemblies includes the circuit board, the photosensitive element, and the molding base, wherein the molding base is integrally molded on the circuit board and the photosensitive element and forms the light window that provides the light path for the photosensitive element. ### Claim 58 (depends on 56) The method according to claim 56, wherein the first angle and the third angle are 3° to 80°. ### Claim 59 (depends on 56) The method according to claim 56, wherein the second angle and the fourth angle are 0° to 20°. ### Claim 60 (depends on 56) The method according to claim 56, wherein a first height of the first partial surface in a direction perpendicular to the surface of the photosensitive element and a third height of the third partial surface in the direction are 0.05 mm˜0.7 mm. ### Claim 61 (depends on 56) The method according to claim 56, wherein a second height of the second partial surface in a direction perpendicular to the surface of the photosensitive element and a fourth height of the fourth partial surface in the direction are 0.02 mm˜0.6 mm. ### Claim 62 (depends on 56) The method according to claim 56, wherein a width of a bottom end of the first diversion groove is 0.2 mm˜1 mm. ### Claim 63 (depends on 56) The method according to claim 56, wherein the one-piece molding base is integrally molded on one row of the circuit boards and one row of the photosensitive elements; or the one-piece molding base is integrally molded on two adjacent rows of the circuit boards and the two adjacent rows of the photosensitive elements, wherein the two adjacent rows of the circuit boards are provided so that their flexible regions are away from each other and their rigid regions are adjacent to each other. ### Claim 64 A photosensitive assembly, comprising: a circuit board a photosensitive element, which is operatively connected to the circuit board; and a molding base, which is integrally molded with the circuit board and the photosensitive element and forms a light window, wherein the molding base has one or more first portion inner surfaces adjacent to the photosensitive element and one or more second partial inner surfaces connected to the first portion inner surface away from the photosensitive element, wherein there is an included angle α between the first portion inner surface and an optical axis of the photosensitive assembly, there is an included angle β between the second portion inner surface and the optical axis of the photosensitive assembly, wherein β<α. ### Claim 65 (depends on 64) The photosensitive assembly according to claim 64, wherein the numerical range of α is 3°˜80°, and the numerical range of β is 0°˜20°. ### Claim 66 (depends on 64) The photosensitive assembly according to claim 64, wherein the molding base includes a photosensitive element coupling portion and a top side extending portion located around the light window, an inner surface of the photosensitive element coupling portion integrally extending from the photosensitive element defines the first portion inner surface, the top side extending portion integrally extends from the photosensitive element coupling portion, and the surface thereof defines the second portion inner surface, the second portion inner surface integrally extends from the first portion inner surface. ### Claim 67 (depends on 66) The photosensitive assembly according to claim 66, wherein the numerical value of β is 0°, the photosensitive element coupling portion is a vertically extending portion accordingly. ### Claim 68 (depends on 66) The photosensitive assembly according to claim 66, wherein a thickness of the top side extending portion is in a range of 0.02 mm˜0.6 mm, and a thickness of the photosensitive element coupling portion is in a range of 0.05 mm˜0.7 mm. ### Claim 69 (depends on 66) The photosensitive assembly according to claim 66, wherein the molding base further includes a circuit board coupling portion, and the photosensitive element coupling portion integrally extends from the circuit board coupling portion and is located between the top side extending portion and the circuit board coupling portion, the circuit board coupling portion is integrally coupled to the circuit board and located around the photosensitive element. ### Claim 70 (depends on 64) The photosensitive assembly according to claim 64, wherein a distance between a position where the first portion inner surface and the second portion inner surface are integrally connected and an optical axis of the photosensitive assembly is less than a distance between an outer edge of the photosensitive element and an optical axis of the photosensitive assembly. ### Claim 71 (depends on 64) The photosensitive assembly according to claim 64, wherein the circuit board and the photosensitive element are connected by a series of connecting wires, and the series of connecting wires are embedded by the molding base, wherein a direction of the wired connection between the circuit board and the photosensitive element is from the circuit board to the photosensitive element; or a direction of the wired connection between the circuit board and the photosensitive element is from the photosensitive element to the circuit board. ### Claim 72 (depends on 71) The photosensitive assembly according to claim 71, wherein a position where the first portion inner surface and the second portion inner surface are connected is located at an inner side of the connecting wire. ### Claim 73 (depends on 64) The photosensitive assembly according to claim 64, wherein the photosensitive assembly is cut from a photosensitive assembly jointed panel, and the circuit board is cut from one or more rows of the circuit boards, each row of the circuit boards includes one or more circuit boards arranged side by side, each of the circuit boards includes a rigid region and a flexible region combined with each other; the photosensitive element is cut from one or more rows of photosensitive elements; and the molding base is cut from one or more of one-piece molding bases, each of the one-piece molding bases is integrally molded on a row of the circuit boards and a row of the photosensitive elements and forms a light window that provides a light path for each of the photosensitive elements; wherein a first end side corresponding to the one-piece molding base adjacent to the flexible region has a first side surface facing the light window, and the first side surface includes a first partial surface provided adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface relative to an optical axis of the camera module is greater than a second angle of the second partial surface relative to the optical axis; an opposite second end side corresponding to the one-piece molding base away from the flexible region has a second side surface facing the light window, and the second side surface includes a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis. ### Claim 74 (depends on 64) The photosensitive assembly according to claim 64, wherein the photosensitive assembly is cut from a photosensitive assembly jointed panel, and the circuit board is cut from multiple rows of circuit boards, each row of the circuit boards including one or more circuit boards arranged side by side, each of the circuit boards including a rigid region and a flexible region combined with each other; the photosensitive elements is cut from multiple rows of photosensitive elements; and the molding base is cut from one or more of one-piece molding bases, each of the one-piece molding bases is integrally molded on two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements and forms a light window that provides a light path for each of the photosensitive elements, and the two adjacent rows of the circuit boards are arranged so that their flexible regions are away from each other and their rigid regions are adjacent to each other, so that each of the one-piece molding bases has the two end sides adjacent to the flexible regions, wherein a first end side corresponding to the one-piece molding base adjacent to the flexible region has a first side surface facing the light window, the first side surface includes a first partial surface provided adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface relative to an optical axis of the camera module is greater than the second angle of the second partial surface relative to the optical axis; a second end side of the one-piece molding base extending between the two adjacent rows of the photosensitive elements has a second side surface facing the light window, the second side surface includes a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis. ### Claim 75 (depends on 64) A camera module, comprising a lens and the photosensitive assembly according to claim 64.