# US 2020/0286799 A1 · Semiconductor device and manufacturing method thereof

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- Number: US 2020/0286799 A1
- Document ID: US20200286799A1
- Status: Published application
- Kind: A1
- Application number: 16/593,640
- Filed: 2019-10-04
- Published: 2020-09-10
- Earliest claimed: 2019-03-06
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Hiroyuki MASUMOTO
- Web page: https://patentgrep.com/patent/US20200286799A1

## CPC

- H10W 76/161: {Containers comprising no base}
- H10W 76/47: Solid or gel fillings
- H10W 72/075: {of bond wires}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 74/124: {the encapsulations having cavities other than that occupied by chips}
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- H10W 76/60: Seals
- H10W 72/07554: {changes in dispositions}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 90/00: Package configurations
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device includes: a semiconductor chip; a case storing the semiconductor chip; a wire bonded to the semiconductor chip; a cover fixed inside the case and including a concave portion disposed above the semiconductor chip and the wire; and a sealing resin potted inside the case and sealing the semiconductor chip, the wire and the cover, wherein the sealing resin is not filled in the concave portion so that a cavity is provided.

## Claims

### Claim 1

A semiconductor device comprising:
a semiconductor chip;
a case storing the semiconductor chip;
a wire bonded to the semiconductor chip;
a cover fixed inside the case and including a concave portion disposed above the semiconductor chip and the wire; and
a sealing resin potted inside the case and sealing the semiconductor chip, the wire and the cover,
wherein the sealing resin is not filled in the concave portion so that a cavity is provided.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, wherein the concave portion is provided on a lower surface of the cover.

### Claim 3 (depends on 1)

The semiconductor device according to claim 1, wherein the concave portion is provided on an upper surface of the cover.

### Claim 4 (depends on 1)

The semiconductor device according to claim 1, wherein the cover is fitted to the case.

### Claim 5 (depends on 2)

The semiconductor device according to claim 2, wherein the cover is fitted to the case.

### Claim 6 (depends on 3)

The semiconductor device according to claim 3, wherein the cover is fitted to the case.

### Claim 7 (depends on 1)

The semiconductor device according to claim 1, wherein the cover is attached to the case with an adhesive.

### Claim 8 (depends on 2)

The semiconductor device according to claim 2, wherein the cover is attached to the case with an adhesive.

### Claim 9 (depends on 3)

The semiconductor device according to claim 3, wherein the cover is attached to the case with an adhesive.

### Claim 10 (depends on 1)

The semiconductor device according to claim 1, wherein the semiconductor chip is made of a wide-band-gap semiconductor.

### Claim 11 (depends on 2)

The semiconductor device according to claim 2, wherein the semiconductor chip is made of a wide-band-gap semiconductor.

### Claim 12 (depends on 3)

The semiconductor device according to claim 3, wherein the semiconductor chip is made of a wide-band-gap semiconductor.

### Claim 13 (depends on 4)

The semiconductor device according to claim 4, wherein the semiconductor chip is made of a wide-band-gap semiconductor.

### Claim 14 (depends on 7)

The semiconductor device according to claim 7, wherein the semiconductor chip is made of a wide-band-gap semiconductor.

### Claim 15

A method of manufacturing a semiconductor device comprising:
storing a semiconductor chip in a case;
bonding a wire to the semiconductor chip;
fixing a cover inside the case so that a concave portion of the cover is disposed above the semiconductor chip and the wire; and
potting a sealing resin inside the case to seal the semiconductor chip, the wire and the cover,
wherein the sealing resin is not filled in the concave portion so that a cavity is provided.

### Claim 16 (depends on 15)

The method of manufacturing a semiconductor device according to claim 15, comprising:
potting only a portion of the sealing resin to seal the semiconductor chip and the wire;
after potting the portion of the sealing resin, fixing the cover above the semiconductor chip and the wire; and
potting a rest of the sealing resin to seal the cover.

### Claim 17 (depends on 15)

The method of manufacturing a semiconductor device according to claim 15, wherein when all the sealing resin is potted and a height level of the sealing resin is lower than a height level reference line formed on an inner side surface of the case, forming failure of the cavity is determined.

### Claim 18 (depends on 16)

The method of manufacturing a semiconductor device according to claim 16, wherein when all the sealing resin is potted and a height level of the sealing resin is lower than a height level reference line formed on an inner side surface of the case, forming failure of the cavity is determined.