Regulation plate, plating apparatus equipped with the same, and plating method
AssigneeEbara Corporation
InventorsYoichi NAKAGAWA, Jumpei FUJIKATA
Life of this patent
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Abstract
The present invention provides a regulation plate and a plating apparatus equipped with the regulation plate which can curb reduction in in-plane uniformity due to influence of a terminal effect with respect to plural substrates differing in characteristics and processing conditions. One form of the present invention provides a regulation plate used to adjust an electric current between an anode and a substrate to be plated. The regulation plate includes a plate main body provided with an opening adapted to allow passage of an electric current; plural first blades used to narrow a diameter of the opening; and a first moving mechanism adapted to translate the plural first blades in a radial direction of the opening.
Claims12
A regulation plate used to adjust an electric current between an anode and a substrate to be plated, comprising:
- a plate main body provided with a rim forming a first opening adapted to allow passage of an electric current;
- plural first blades used to narrow a diameter of the first opening;
- and
- a first moving mechanism adapted to translate the plural first blades in a radial direction of the first opening.
A regulation plate used to adjust an electric current between an anode and a substrate to be plated, comprising:
- a first plate main body provided with a first rim forming a first opening adapted to allow
- passage of an electric current and plural first blades used to narrow a diameter of the first opening;
- and
- a second plate main body provided with a second rim forming a second opening adapted to allow passage of an electric current and plural second blades used to narrow a diameter of the second opening, wherein
- the first plate main body and the second plate main body are coupled together such that a straight line joining a center of an opening formed by the plural first blades and a center of an opening formed by the plural second blades is orthogonal to the radial direction of the openings.
A plating method comprising:
- placing an anode holder in a plating bath, where the anode holder is integrally provided with an anode mask having a first opening adapted to allow passage of an electric current flowing between an anode and a substrate;
- placing a substrate holder adapted to hold a first substrate in the plating bath;
- placing a regulation plate between the anode mask and the substrate, where the regulation plate includes a second opening and third opening adapted to allow passage of the electric current flowing between the anode and the substrate;
- plating the first substrate by adjusting a diameter of the first opening to a first diameter;
- placing a substrate holder adapted to hold a second substrate in the plating bath;
- and
- plating the second substrate by adjusting a diameter of the first opening to a second diameter smaller than the first diameter and by changing the diameters of the second opening and third opening in the regulation plate.
Dependencies are inferred from the claim text.