Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure

A multicomponent curable thermally conductive silicone gel composition comprising:

• (A) an alkenyl group-containing organopolysiloxane having a viscosity at 25° C. of 10 to 100,000 mPa·s in an amount of 100 parts by mass;
• (B) an organohydrogenpolysiloxane in an amount such that the silicon-bonded hydrogen atoms in component (B) are from 0.2 to 5 mol per mol of alkenyl groups in component (A);
• (C) a hydrosilylation reaction catalyst in a catalytic amount;
• (D) a thermally conductive filler;
• (E) one or more silane coupling agents or hydrolyzed condensates thereof;
• and
• (F) an organopolysiloxane having a hydrolyzable silyl group at one end of the molecular chain;
• wherein at least liquids (I) and (II) below are stored separately;
• (I):
• a liquid A-composition containing components (A), (C), (D), (E) and (F), but not component (B), and
• (II):
• a liquid A composition containing components (B), (D), (E) and (F), but not component (C);
• and
• wherein
• the amount of component (D) in the liquid (I) is from 600 to 3,500 parts by mass,
• the amount of component (D) in the liquid (II) is from 600 to 3,500 parts by mass, and
• the mass ratio of the sum of component (E) and component (F) in liquid (II) to the sum of component (E) and component (F) in liquid (I) is in a range from 1.5 to 10.0.