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US 2020/0270447 A1Published application
Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
AssigneeHitachi Chemical Company, Ltd.
InventorsNaoki MARUYAMA, Yuka YOSHIDA, Tomoko HIGASHIUCHI, Kazumasa FUKUDA, Keiichiro NISHIMURA, Yoshitaka TAKEZAWA
Life of this patent
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Abstract
An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.
Claims7
An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.
Dependencies are inferred from the claim text.