Thermoformed film compositions with enhanced toughness after thermoforming processes
AssigneesDow Global Technologies LLC, PBBPolisur S.R.L.
InventorsMaria Laura Perez Muñoz, João Gargalaka, Jr., Nicolas Cardoso Mazzola, Gianna Buaszczyk, Carmelo Declet Perez, Sydney E. Hansen
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Abstract
Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2≥7.0-1.2×log (I2).
Claims16
A thermoformed multilayer film structure comprising:
- a core layer and at least two outer layers disposed externally relative to the core layer,
- wherein at least one layer of the thermoformed multilayer film structure comprises a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation:
- I10/I2≥7.0-1.2×log (I2).
A thermoformed monolayer film comprising:
- a first composition comprising at least one ethylene based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation:
- 110/I2≥7.0-1.2×log (I2),
- wherein the thermoformed monolayer film demonstrates an increase in puncture resistance of at least 10% due to thermoforming applications.
Dependencies are inferred from the claim text.