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US 2020/0270380 A1Published application
Aqueous ethylene resin dispersion and aqueous heat sealing material
AssigneeSumitomo Seika Chemicals Co., Ltd.
InventorsJunichi MIZUKAWA, Masafumi OKAMOTO, Norihiro SUGIHARA, Hiromasa MIYAZAKI
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Abstract
Provided is an ethylene-based resin aqueous dispersion that can form a film having excellent airtightness and adhesiveness when applied to a substrate, such as a fiber substrate. The ethylene-based resin aqueous dispersion of the present invention comprises a copolymer containing an ethylene unit and an α,β-unsaturated carboxylic acid salt unit, a fatty acid salt, and an aqueous medium, wherein the copolymer and the fatty acid salt are dispersed in the aqueous medium.
Claims5
An ethylene-based resin aqueous dispersion comprising:
- a copolymer containing an ethylene unit and an α,β-unsaturated carboxylic acid salt unit, a fatty acid salt, and an aqueous medium, wherein the copolymer and the fatty acid salt are dispersed in the aqueous medium.
Dependencies are inferred from the claim text.