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US 2020/0270122 A1Published application
Multi-cavity package for ultrasonic transducer acoustic mode control
AssigneeChirp Microsystems, Inc.
InventorsStefon Shelton, Fabian Goericke
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Abstract
A micromechanical system (MEMS) device package comprising a substrate and a first enclosure including a first cavity, coupled to the substrate. Wherein a transverse dimension of the first cavity relative to the substrate is configured to reduce undesirable acoustic modes within the first cavity and the first cavity comprises an acoustic port. A MEMS device is located inside the first cavity and an Application Specific Integrated Circuit (ASIC) is communicatively coupled to the MEMS device and located outside the first cavity.
Claims24
A micromechanical system (MEMS) device package comprising;
- a substrate;
- a first enclosure including a first cavity, coupled to the substrate and wherein a transverse dimension of the first cavity relative to the substrate is configured to reduce undesirable acoustic modes within the first cavity, where in the first cavity comprises an acoustic port;
- a MEMS device located inside the first cavity;
- an Application Specific Integrated Circuit (ASIC) communicatively coupled to the MEMS device and located outside the first cavity.
1 more element
Dependencies are inferred from the claim text.