Electronic Circuit Structure and Method of Fabricating Electronic Circuit Structure Having Magnetoresistance Element with Improved Electrical Contacts

An electronic circuit structure, comprising:

• a semiconductor substrate, a top surface of the semiconductor substrate comprised of a first layer of insulating material, the top surface of the semiconductor substrate comprising first and second conductive vias passing through the top surface, the top surface of the semiconductor substrate being a polished surface;
• first and second conductive contacts having a separation parallel to the top surface of the semiconductor substrate, wherein the first conductive contacts is disposed between the first conductive via and the magnetoresistance element and the second conductive contact is disposed between the second conductive via and the magnetoresistance element, wherein the first conductive contact is in electrical contact with the first conductive via and not with the second conductive via, and wherein the second conductive contact is in electrical contact with the second conductive via and not with the first conductive via;
• and
• a magnetoresistance element disposed upon the first and second conductive contacts, the magnetoresistance element having a bottom surface in electrical contact with the first and second conductive contacts and a top surface distal from the first and second conductive contacts, wherein the first and second conductive vias are operable to pass a current from the first conductive via to the first conductive contact, from the first conductive contact to the magnetoresistance element, through the magnetoresistance element in a direction substantially parallel to the top surface of the substrate, from the magnetoresistance element into the second conductive contact, and from the second conductive contact to the second conductive via.

A method of fabricating an electronic circuit structure, comprising;

• providing a semiconductor substrate having first and second conductive vias;
• creating first and second conductive contacts in electrical contact with the first and second conductive vias;
• and
• depositing a magnetoresistance element over and in electrical contact with the first and second conductive contacts.

An electronic circuit structure, comprising:

• a semiconductor substrate having first and second conductive vias;
• first and second conductive contacts disposed over and in electrical contact with the first and second conductive vias;
• and
• depositing a magnetoresistance element over and in electrical contact with the first and second conductive contacts.